FOUNTAIN HILLS, Ariz., May 15, 2012 — OpenSystems Media (OSM), LLC today announced the addition of a new embedded moderator, Jim Turley, internationally known industry leader and editor, effective immediately. He is the former Editor-in-Chief of Embedded Systems Design magazine and Embedded Systems Conference Chair. Turley will be working with OpenSystems Media moderating embedded webcasts and virtual events. Turley will be the Embedded Moderator for Embedded Computing Design magazine.

OSM is one of the largest providers of editor-moderated webcasts in the embedded space. OSM, the leading producer of embedded E-casts in the industry, continues to be successful with their webcasts because they provide the right tools, leading editorial staff, and a robust streaming architecture, which delivers a seamless experience for online attendees.

The first major initiative is OSM’s Fundamentals of Embedded Computing webcasts. Topics will include:

• Choosing a Processor

• Choosing an Operating System

• Tools, Debugging, Support, and Training

• ARM vs. Anyone Else

• Designing a GUI

• MCU Upgrade: Moving up From 8-bit to 16/32-bit

• Ins and Outs of Open Source

“We are very excited to have yet another industry leader/veteran added to our webcasting team. OSM continues to drive the brightest minds with the best topics for our embedded webcasts,” said Christi Long, Director of Online Business, OpenSystems Media. “We are the largest provider of topics covering the embedded marketplace.”

“In the recent months, some publishers have abandoned their coverage of the embedded space. Our hiring of Jim Turley and our newest Embedded App reinforces our print and online commitment,” said Patrick Hopper, Publisher, OpenSystems Media.

“OSM continues to be a driving force and leader in the embedded marketplace. I am excited to be a part of the OpenSystems Media team and I look forward to adding my 25 years of experience to their expanding webcast initiatives,” said Turley.

Turley is an acknowledged authority on microprocessor chips, semiconductor technology, and embedded systems. He is founder and principal analyst at Silicon Insider, a technology consulting firm specializing in microprocessors and embedded software, providing technical and financial/market analysis for microprocessors, semiconductor Intellectual Property (IP), embedded technology, computers, and silicon technology. Turley is the editor of Electronic Engineering Journal and former Editor-in-Chief of the prestigious industry journal Microprocessor Report. He is the author of seven books and is a popular speaker at industry events.

If you are interested in any of the upcoming webcasts or would like Jim Turley to moderate a webcast, please contact Patrick Hopper.

Jim Turley can be reached at jturley@opensystemsmedia.com

Pat Hopper can be reached at phopper@opensystemsmedia.com

Christi Long can be reached at clong@opensystemsmedia.com

About OpenSystems Media

OpenSystems Media has been a leading publisher of electronics magazines, e-mail newsletters, websites, and product resource guides for more than 20 years. OpenSystems Media is also the leader in driving leads and awareness through social media and is the largest producer of lead-generation tools such as webcasts, whitepapers, product directories, Tech E-Briefs, TechChannels, and Techcasts. OpenSystems Media offers E-casts and Techcasts for engineers and provides interactive tools where engineers can communicate directly with presenters and top industry editors. OpenSystems Media also offers the Embedded Computing Design iPhone and iPad app for the embedded industry. Current publications include: Embedded Computing Design; Military Embedded Systems; CompactPCI, AdvancedTCA, & MicroTCA Systems; DSP-FPGA.com; PC/104 and Small Form Factors; and VITA Technologies. For more information, visit www.opensystemsmedia.com.

Extreme Engineering Solutions (X-ES) announces XPedite5205, a versatile, Size, Weight, and Power (SWaP)-optimized, embedded router module hosting Cisco IOS® IP Routing software. The XPedite5205 Embedded Services Router (ESR) provides mobile, ad hoc networking for military and emergency response, and it extends the Cisco enterprise infrastructure beyond the reach of traditional fixed-network infrastructure for oil and gas, mining, smart grid, transportation, and public safety applications.

The XPedite5205 ESR incorporates Cisco Mobile Ready Net capabilities to provide highly secure data, voice, and video communications to stationary and mobile network nodes across both wired and wireless links. Combining the XPedite5205 ESR with UHF, VHF, Wi-Fi, and other radio platforms enables integrators to create mobile, wireless, ad hoc networks, without requiring a connection to central infrastructure.

As a PMC/XMC module, the XPedite5205 can be retrofitted instantly for use in any available PMC or XMC site, leveraging 20 years of deployed VME, CompactPCI, VPX, and custom systems. It also can be mounted on an application-specific carrier card or used on an X-ES development carrier. The rugged XPedite5205 ESR module can be deployed in the harshest environments for embedded applications with SWaP constraints.

The XPedite5205 ESR features include:

• Freescale Power Architecture Processor

• Four integrated 10/100/1000 Ethernet ports

• Cisco IOS Release 15.2GC Software

• Cisco Unified Communications Manager Express (CME) support

• Cisco Mobile Ready Net, which allows for mobile ad hoc networking and Radio Aware Routing (RAR) with Dynamic Link Exchange Protocol (DLEP)

• On-board hardware acceleration and encryption

• Integrated threat control using Cisco IOS Firewall, Cisco IOS Zone-based Firewall, Cisco IOS Intrusion Prevention System (IPS), and Cisco IOS Content Filtering

• Identity management using authentication, authorization, and accounting (AAA) and public key infrastructure

• Conduction- or air-cooled PMC/XMC form factor with max power consumption of 15W

“We estimate there are 6,000,000 open PMC module sites that could host an XPedite5205 tomorrow running Cisco IOS. These open module sites span across industries, from telecommunications base stations to industrial mining operations to hardened military systems,” states Bret Farnum, VP Sales & Marketing at X-ES. Adds Farnum, “With the clear majority of IT professionals being trained on Cisco IOS, adding an XPedite5205 to an already deployed system requires no training time or expense.”

“With the introduction of the Cisco 5205 Embedded Service Router, Cisco is extending the flexible, ruggedized options available to customers and partners for embedded deployments,” states Tony Jeffs, senior director of marketing, Cisco Global Government Solutions Group. “Collaborating with X-ES, an embedded computing leader, enabled us to bring a product to market much more quickly. X-ES is expanding the Cisco IOS market by providing rugged routers based on Cisco IOS IP Routing software for embedded applications in harsh environments. This release of Cisco IOS is based on the same software that we use in our enterprise class routers; and therefore, it will leverage the on-going development and support of greater Cisco over the long haul.”

About X-ES — Extreme Engineering Solutions, Inc. (X-ES), a 100% U.S.A. based company, designs and builds single-board computers, I/O boards, power supplies, backplanes, chassis, and system-level solutions for embedded computing customers. X-ES offers cutting-edge performance and flexibility in design, plus an unparalleled level of customer support and service. For further information on X-ES products or services, please visit our website: www.xes-inc.com or call (608) 833-1155.

Data Sheet: www.xes-inc.com/assets/products/files/XPedite52[...]

Press Photo: www.xes-inc.com/assets/photos/content/063706_XP[...]

CAMPBELL, Calif., May 10, 2012 — A new report from Mobile Experts highlights three new technologies which will revolutionize the market for RF components in mobile devices.

“We have five disruptive trends at the same time: Envelope Tracking (ET), Multimode multiband power amplifiers (MMPA), CMOS PAs, Antenna Tuning, and MIMO,” explained Joe Madden, Principal Analyst at Mobile Experts. “Taken together, these changes will create a wholly new architecture for 2015 handsets, tablets, and PCs.

“The number of frequency bands and modes in a mobile handset is growing rapidly. Mobile device OEMs are faced with runaway cost, if they support all of the LTE frequency bands that are coming. Even with these new technologies, the RF content in a high-end smartphone will increase from $6 to $10 over five years.

“Mobile Experts investigated each technology individually, but we found that each disruptive technology is related to the others. CMOS amplifiers will use Envelope Tracking technology. Tuning elements will be used for impedance matching. MIMO will drive huge market growth for antennas and filters. We interviewed more than 50 companies to thoroughly investigate the interplay between all of these new trends.”

Handset RF Front Ends: MMPAs, ET, Tuning, FEMs, and MIMO includes 150 pages of analysis, with 138 charts and exhibits. The comprehensive analysis provides:

Block Diagram examples for Worldphone, Smartphone, Feature Phone, Tablet, and PC RF Front Ends

A five-year RFFE forecast, including:

Antennas

Amplifiers

Filters and Duplexers

Switches

Front End Modules or FEMs (PADs, ASMs, TxMs, Filter/Switch Modules)

Antenna Tuning and Impedance Match Tuning

Multimode, Multiband PAs (MMPAs)

Envelope Tracking PAs (ET PAs)

Terminals including handsets, tablets, PCs, and M2M

Analysis of individual market segments, including:

Unit shipments forecasted for each component

Average Selling Price (ASP) forecasted for each component

Revenue forecasted for each component

RF Front Ends forecasted by air interface standard

Forecasted combinations of technology (ET and MMPA, ET and FEM)

About Mobile Experts LLC:

Mobile Experts provides insightful market analysis for the mobile infrastructure and mobile handset markets. Research topics center on technology introduction for radio frequency (RF) and communications innovation. Recent publications focus on MIMO, Semiconductors for Small Cells, Backhaul for Small Cells, Semiconductors for Remote Radio Heads, AAS, and Macro Base Station Transceiver Forecast.

This growth in the embedded Linux marketplace has created a complex multi-source software supply chain as developers combine in-house developed packages with packages easily found on sites managed by various associations or groups, as well as individuals who offer free code. Learning how to manage the open source development process has become crucial to organizations’ success and risk mitigation.

MontaVista and Black Duck Software will discuss how proper governance of open source can help realize the full benefits of the organization’s Linux-based embedded systems. Both companies will be available for a Q&A session immediately following the E-cast.

• Who: Joe Pearson, Director of Quality Assurance and Build, MontaVista and Phil Odence, Vice President of Business Development, Black Duck Software

• What: Industry experts from MontaVista and Black Duck Software present a live OpenSystems Media E-cast, “Manage the Code, Manage the Device: Open Source Governance in Linux”

• When: Thursday, May 10, 2012 at (2:00 p.m. EDT/11:00 a.m. PT)

• Where: To attend the E-cast, participants can register at ecast.opensystemsmedia.com/326

About OpenSystems Media

OpenSystems Media has been a leading publisher of electronics magazines, e-mail newsletters, websites, and product resource guides for more than 20 years. OpenSystems Media is also the leader in driving leads and awareness through social media and is the largest producer of lead-generation tools such as webcasts, whitepapers, product directories, Tech E-Briefs, TechChannels, and Techcasts. OpenSystems Media offers E-casts and Techcasts for engineers and provides interactive tools where engineers can communicate directly with presenters and top industry editors. Current publications include: Embedded Computing Design; Military Embedded Systems; CompactPCI, AdvancedTCA, & MicroTCA Systems; DSP-FPGA.com; PC/104 and Small Form Factors; and VITA Technologies. For more information, visit www.opensystemsmedia.com.

May 8th, 2012, CTIA, New Orleans, LA – Adax (www.adax.com), an industry leader in high-performance packet-processing, security and network infrastructure, is pleased to announce the availability of the Packet2-PCIe (Pkt2-PCIe) communication controller. The Pkt2-PCIe takes advantage of the advanced Octeon II 66xx NPU to provide front-end intelligent processing for traffic and bandwidth management, QoS and security on all LTE wireless applications, delivering a highly available, high-performance, carrier-grade transport from the edge to core networks. The Octeon II offers 6-10 cores at up to 1.5GHz with 2 or 4GB of DDR3 RAM, delivering line speed packet processing for today’s demanding mobile applications.

The Pkt2-PCIe offers three build-time options for I/O; 2x 10GbE ports, 1x 10GbE plus 4 GbE or 4x GbE interfaces.The Pkt2-PCIe is the perfect intelligent device to process packets for both control and data plane traffic. The board and software provide advanced capabilities, including embedded Adax IPsec based on the AuthenTec QuickSec distribution of security software. The Cavium on-board processor handles thousands of packets per second allowing the host processor to maximize application performance.

This generation of the Pkt2-PCIe is based on the state of the art Cavium Octeon II network processor. The Octeon II utilizes the SDK 2.x which is backward compatible with previous SDKs for the Octeon Plus family NPUs. Applications that run today on SDK 1.x, such as the Adax Pkt-AMC boards and Adax PacketRunner (APR) ATCA carrier blade, may use the same APIs on the Pkt2-PCIe card. This allows existing customers to easily upgrade their applications, systems and architectures with minimal development time, providing fast time to market and reducing CAPEX and OPEX. Designed for use in Rack Mount Servers (RMS) the Pkt2-PCIe serves high availability, high bandwidth carrier applications in LTE wireless network nodes such as the MME, SGW and PWG.

Third party applications and partner software, such as the recently announced EPC Lite ‘Network in a Box’ from Aricent, can be quickly and easily integrated with the PKT2-PCIe to provide solutions for the EPC core network and backhaul application using Carrier Ethernet (CE).

“The Pkt2-PCIe is the most advanced packet processing PCIe communications controller on the market today. Whether you need one or a variety of packet processing functions or intelligent backhaul, Pkt2-PCIe is the card for you,” said Drew Sproul, director of marketing, Adax Inc.

About Adax

Adax is an industry leader in high-performance packet processing, security, and network infrastructure for the All-IP network. For 30 years Adax has uniquely blended software and hardware expertise to create the most productive and efficient products in the telecom industry. The broad and highly-flexible Adax product set consists of protocol controllers, packet processing boards, software protocols, and now integrated systems, for Core Network nodes, Security Gateways, Femto/Home eNodeB Gateways, Policy Servers and Data Offload devices.

Adax meets today’s challenges of scalability, cost effectiveness and high availability with solutions for LTE, 3G, and Legacy networks and the interworking between them. Adax customers include the world’s premier telecom equipment manufacturers (TEMs), value added service (VAS) providers and system integratorsincluding: Alcatel-Lucent, Ericsson, NEC, NSN, Samsung, Aricent, Bravo, Comba, Comviva, Contela, Invigo and NewNet.For 30 years Adax has established an extensive track record for helping customers reduce CAPEX and OPEX whilst increasing their competitive capabilities.www.adax.com

Pixus Technologies, a supplier of backplane, enclosure, and embedded component solutions, now offers VME64x backplanes in high-power, pluggable, and standard versions.

VME64x (VME64 extensions) backplanes typically come in a 6U height. Pixus offers 6U VME64x backplanes in various slot sizes with power bugs above and below the slots. To meet VITA 1.7 Increased Current specification or high-power VME applications, Pixus also offers 6.5U high backplanes with extra power bugs on the bottom of the board. The backplanes feature automatic daisy chaining, chassis ground connections, and a 10-layer (typical) multilayer construction. They also have a utility connector for sense, fail, reset, and ground signals.

Another power option for VME-based systems is to use a pluggable 47-pin connector. These can be implement in vertical-mount backplanes parallel to the signal slots. Or, the PSU connectors can be incorporated in horizontal-mount backplanes, extending outside of the card cage in a 9U monolithic format. This is also a common configuration for CompactPCI SlimBox backplanes. Pixus offers 9U VME64x backplanes in the horizontal format in 2-8 slot sizes.

The Pixus Backplane Division also offers backplanes in OpenVPX, CompactPCI, PCIe, ATCA, and custom designs.

Extreme Engineering Solutions (X-ES), embedded computing market leader, today announced that its XPedite7332 has achieved VMware Ready™ status. This designation indicates that the CompactPCI Single Board Computer (SBC) has passed a detailed evaluation and testing process managed by VMware and is now listed on the VMware Solution Exchange (VSX). Product listing location – https://solutionexchange.vmware.com/store/produ[...]

Passing the extensive VMware-specified testing helps ensure that the XPedite7332 SBC makes best use of VMware technology and is ready for deployment in customer environments.

“We are pleased that the XPedite7332 qualifies for the VMware Ready™ logo, signifying to customers that it has passed specific VMware testing and interoperability criteria and is ready to run in production environments,” said Sheryl Sage, Director, Alliance Programs, VMware. “Customers now have more choices with VMware vSphere ™, which has been expanded to cover a broad range of embedded processors, I/O devices, and servers.”

“By using the XPedite7332 with VMware Hypervisor (aka ESXi 5.0 Update 1) enterprises can run multiple mission-specific and advanced networking applications from Cisco, such as Unified Communications Manager (UCM), Virtual Wide Area Application Services (vWAAS), and Security Gateway on a rugged CompactPCI SBC to extend the same enterprise services that Cisco applications provide running on rack-mount servers to rugged, deployed systems in vehicles and aircraft,” said Bret Farnum, VP of Sales and Marketing for X-ES.”

The VMware Ready program is a VMware co-branding program for qualified partner products and is a benefit of the VMware Technology Alliance Partner (TAP) program. With more than 2,000 members worldwide, the VMware TAP program works with best-of-breed technology partners to provide them a comprehensive set of VMware technical and marketing services, support, tools and expertise to deliver enhanced value to joint customers.

Extreme Engineering Solutions XPedite7332 SBC can be found within the online VMware Solutions Exchange at solutionexchange.vmware.com.

About X-ES — Extreme Engineering Solutions, Inc. (X-ES), a 100% U.S.A. based company, designs and builds single-board computers, I/O boards, power supplies, backplanes, chassis, and system-level solutions for embedded computing customers. X-ES offers cutting-edge performance and flexibility in design, plus an unparalleled level of customer support and service. For further information on X-ES products or services, please visit our website at www.xes-inc.com, or call (608) 833-1155.

NEW ORLEANS, May 7, 2012 — CTIA Wireless – PT (NASDAQ: PTIX), a leading global supplier of advanced network communications, today announced its Universal Diameter Router (UDR), broadening the company’s SEGway Signaling line of IP-native products. UDR provides essential functions of centralized core and edge routing for Diameter Protocol elements widely used in the all-IP, service-oriented, IMS and Long Term Evolution (LTE) architecture networks. These functions include:

Diameter Routing Agent (DRA) as specified by 3GPP

Diameter Edge Agent (DEA), the GSMA specification

Diameter Protocol per IETF specifications

Interworking Function (IWF) as per 3GPP

As IMS and LTE infrastructures are deployed, new elements such as policy servers, gateways, session controllers, and charging systems are interconnected and interwork via Diameter Protocol to exchange network information. The rapid proliferation of these adjunct network devices, together with the exploding appetite for extreme bandwidths enabled by LTE and IMS, result in the need to manage enormous increases in signaling traffic within the network. The sheer volume and complexity of Diameter traffic places staggering demands on core signaling elements; with SEGway’s IP-native, built-for-purpose platform, service providers attain scalable high performance with powerful multi-core processors, 10Gb point-to-point backplane speeds and 40Gb uplink. The flexible routing engine and advanced screening capabilities provide the ability to route and screen on any parameter in the message. Architected for extensibility as well as straightforward evolution to future Diameter applications, this high-powered platform makes SEGway UDR ideal for Next-Generation Network (NGN) deployments.

“The SEGway UDR fully leverages our substantive portfolio of IP-centric and advanced network routing hardware and software technologies with the expertise gained by our long history of deploying carrier grade network solutions,” said John Slusser, President and CEO of PT. “It is this unique combination of technology and real-world network experience that results in the SEGway UDR being a best-of-breed solution for a wide range of Diameter signaling requirements in Next-Generation Network architectures.”

Patt Rice, PT’s Senior VP, Sales, Marketing and Service, commented, “PT has been diligently monitoring the industry to determine the volume and capacity requirements in the Evolved Packet Core as service providers migrate to LTE. Ever mindful of carriers’ OPEX concerns, we are convinced PT’s UDR is the right solution in the right market conditions. It allows service providers to leverage existing networks’ infrastructure on their path to LTE using a richly featured and precision-tuned, cost-conscious platform, avoiding the expense and drawbacks of some early off-the-shelf entries. With SEGway, the Next-Gen service provider benefits through Simply Smarter Signaling, the PT advantage.”

PT’s SEGway Signaling products are deployed in over one thousand locations, providing the Signaling backbone for many of the world’s premier wireless networks. With its small footprint and high throughput capacity, SEGway is widely recognized as the industry’s leading signaling architecture, with the ability to scale from small to very large networks.

Online Resources

pt.com/products/ngn-applications/universal-diam[...]

About PT (www.pt.com)

PT (NASDAQ: PTIX) is a global supplier of advanced network communications solutions to service provider, government, and OEM markets. PT’s portfolio includes IP-centric network elements and applications designed for high availability, scalability, and long life cycle deployments. The industry-leading Monterey MicroTCA and IPnexus Application-Ready Platforms anchor the company’s broad range of offerings. PT’s SEGway Signaling Solutions provide affordable, high density signaling, advanced Diameter routing for LTE and IMS applications, IP migration, gateway capabilities, and core-to-edge distributed intelligence, as well as features such as Number Portability and SMS Spam Defense. The SIP-based Xpress product family enables service providers to provision a wide range of revenue generating and churn-reducing applications in either cloud-based or captive architectures. PT is headquartered in Rochester, NY and maintains sales and engineering offices around the world.

Extreme Engineering Solutions, Inc. (X-ES) introduces XPedite7450, a rugged COM Express® module that complies with the PICMG COM Express Basic form factor (95mm x 125mm) and supports an enhanced Type 6 pinout. The XPedite7450 can be hosted on a standard COM Express carrier card or a custom carrier card built to include additional end-user requirements, or it can be integrated into an X-ES XPand6000 Small Form Factor (SFF) rugged system. Based on the 3rd generation Intel® Core™ i7 quad-core processor, the XPedite7450 operates at up to 2.2 GHz to deliver enhanced performance and efficiency, making it an excellent processor mezzanine for commercial, industrial, and military applications.

Designed and tested for the harshest military, aerospace, and industrial environments, the XPedite7450 includes enhancements above and beyond commercial COM Express modules. It provides a rugged and reliable COTS processor mezzanine solution with these benefits:

• Incorporates the same design and manufacturing principles as all X-ES Level 5 rugged products

• Designed and tested for operation from -40 to +85ºC

• Includes additional mounting holes for increased structural integrity

• Provides extended shock and vibration capabilities for operation in harsh environments

• Features conduction-cooled and air-cooled applications supported by a single design

• Soldered-down memory replaces less rugged/reliable SO-DIMMs

• Utilizes tin-lead manufacturing process to mitigate tin-whisker effects (RoHS-compliant process is also available)

• Provides BIT support

Targeting the quad-core Intel Core i7-3612QE processor with clock speeds up to 2.1 GHz, the XPedite7450 features up to 16 GB of DDR3-1333/DRR3-1600 ECC SDRAM, an integrated high-performance 3D graphics controller, enhanced Type 6 pinout, five Gen2 PCI Express ports, four USB 2.0 high-speed ports, six SATA 3.0 Gb/s ports, and an Intel® High Definition Audio port. BSPs for Linux, INTEGRITY, and VxWorks and Windows drivers are available. QNX, LynxOS, and other OS support may be available, as needed. The XPedite7450 is scheduled for initial delivery in July 2012.

The XPedite7450 is the perfect compute element for the rugged XPand6000 SFF system. Supporting natural conduction and convection cooling with minimal SWaP, an XPand6000-based system can be bolted to almost any available surface of a small UAV, ground vehicle, or heavy equipment. In an extremely small and lightweight package weighing as little as 3.5 lbs. and only taking up 72 cubic inches, XPand6000 systems combine high-performance processing and application specific I/O added via PMCs/XMCs to provide MIL-STD-1553, CANbus, video input, RS-232/422, GPIO, A/D, D/A and other I/O.

In addition to COM Express, X-ES is supporting 3rd generation Intel® Core™ i7 processors across our seven other industry-standard form factors: 3U VPX, 6U VPX, 3U CompactPCI, 6U CompactPCI, VME, air-cooled PrPMC/XMC, and conduction-cooled PrPMC/XMC. The XPedite7470 3U VPX Single Board Computer (SBC) and the XCalibur4401 6U CompactPCI SBC, as well as the XPedite7450, are the first available products to use these processors.

About X-ES — Extreme Engineering Solutions, Inc. (X-ES), a 100% U.S.A. based company, designs and builds single-board computers, I/O boards, power supplies, backplanes, chassis, and system-level solutions for embedded computing customers. X-ES offers cutting-edge performance and flexibility in design, plus an unparalleled level of customer support and service. For further information on X-ES products or services, please visit our website at www.xes-inc.com, or call (608) 833-1155.

Eching, Germany, May 2, 2012 –Kontron today announced the support of the quad-core 3rd generation Intel® Core™ i7-3615QE (4×2.3GHz, 6MB L2 cache) and i7-3612QE (4×2.1GHz, 6MB L2 cache) processors on seven embedded computing platforms, to match the market demands for ever increasing power savings and performance gains. These are the first boards and modules to feature the increased computing power, graphics performance, long-term availability and energy efficiency of the new transistor technology from Intel. Available in COM Express® basic, Flex-ATX, Mini-ITX, AdvancedMC™, 3U and 6U CompactPCI® as well as 3U VPX, Kontron gives OEMs a jump-start in developing a broad range of leading-edge compute- and graphics-intensive applications.

Based on Intel’s innovative 22-nanometer (nm) 3-D tri-gate transistor technology, the 3rd generation Intel® Core™ i7 processor-based boards provide up to 20% enhanced computing power and up to 40% increased performance per watt compared to designs based on the 2nd generation Intel® Core™ processors. Kontron’s new embedded computing platforms enable OEMs to build applications with increased processing density and I/O bandwidth within tight thermal envelopes. This also meets and exceeds the requirement for improved size, weight and power (SWaP) of embedded designs and enables designers to utilize the power of the latest quad-core Intel processors for the first time on small form factors such as COM Express®, AdvancedMC™ and 3U VPX. Additionally, improved Intel® Advanced Vector Extensions (AVX) floating point instruction set for signal processing and SSE instruction sets provide developers the tools to use the increased floating point performance for high performance embedded computing applications in markets such as military, avionics and medical.

Further advancements include the integrated Intel® HD Graphics 4000 that features over 16 execution units which is 30% more than the 2nd generation Intel® Core™ processors provide, and offers, in addition to VGA and LVDS, native support of three independent digital display interfaces, each of which can be configured for DisplayPort (DP), HDMI or DVI displays for sophisticated applications found in markets such as medical, infotainment and industrial automation. A high performance MPEG-2 hardware decoding unit allows for decoding of multiple high resolution full HD videos in parallel. OEMs and designers benefit from up to twice the HD media and up to 60% 3-D graphics performance for an improved user experience and stunning visuals. With support for Intel® Flexible Display Interface (FDI), DirectX® 11, OpenGL® 3.1 and OpenCL™ 1.1 developers can now use the latest APIs to accelerate the design of their applications. Kontron’s platforms also support up to 16GBytes of dual channel DDR3 memory, multiple Gigabit Ethernet, SATA and the latest high-throughput interfaces such as PCI Express 3.0 and USB 3.0 for high-bandwidth applications. The AdvancedMC™ processor module offering this high bandwidth is ideal for MicroTCA™ and AdvancedTCA® based telecommunications applications such as Long Term Evolution (LTE) or LTE-Advanced, wireless base stations, test systems for wire line and wireless network automation, and security applications.

“The outstanding 3rd generation Intel® Core™ processors offer an unprecedented combination of performance gains and power efficiency within a small footprint,” Norbert Hauser, Executive Vice President Marketing at Kontron explained. “Our objective is to get the cutting-edge high performance technology building blocks into our customers hands early so that they can utilize the benefits sooner in their solutions and get to market quickly with their complete applications. Our active involvement with Intel® helps us to ensure our customers’ minimized time-to-market. And with our upcoming system level solutions such as industrial rack mount servers and HMIs as well as integrated CompactPCI® and VPX system platforms, our customers will benefit from reduced R&D costs.”

In addition to standards based boards and modules, Kontron offers extensive custom design and manufacturing services at the board and system levels, to individually tailor platforms based on the 3rd generation Intel® Core™ processors to specific application requirements. Kontron’s service portfolio also includes a wide range of software offerings such as standard OS and hypervisor implementations as well as migration support including validation and verification. The overall goal of these value adding services is to deliver application-ready platforms to customers, thus allowing them to focus on their core competencies and save valuable resources.

For the latest information on Kontron’s new and upcoming products based on the 3rd generation Intel® Core™ processor please visit: www.kontron.com/3rd-gen-intel-core

About Kontron

Kontron is a global leader in embedded computing technology. With more than 40% of its employees in Research and Development, Kontron creates many of the standards that drive the world’s embedded computing platforms. Kontron’s product longevity, local engineering and support, and value-added services, helps create a sustainable and viable embedded solution for OEMs and system integrators. Kontron works closely with its customers on their embedded application-ready platforms and custom solutions, enabling them to focus on their core competencies. The result is an accelerated time-to-market, reduced total-cost-of-ownership and an improved overall application with leading-edge, highly-reliable embedded technology.