EDA Digest is the industry's leading source for news, content, and articles spotlighting the most significant advances in 3D ICs, hardware/software co-design, system-level prototyping, analog and digital verification and physical implementation, and manufacturability and yield optimiz... Moreation. The annual Resource Guide features a graphical depiction of the EDA ecosystem, a variety of product profiles, and a message from the EDA Consortium, while quarterly E-newsletters keep readers in sync with up to date coverage devoted to EDA.
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EDA News
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Tanner EDA Announces All-New Digital Place and Route Tool in Release v16.1 of HiPer Silicon Design Suite
Last week -
ClioSoft’s Ranjit Adhikary to Speak on Design Reuse and IP Management at EDPS
Last week -
Motor Driver from Microchip is Automotive AEC-Q100 Qualified, Highly Integrated and Compact; Provides High Performance and High Current
2 weeks ago
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Tanner EDA Announces All-New Digital Place and Route Tool in Release v16.1 of HiPer Silicon Design Suite
Last week — Tanner EDAHiPer P&R(tm). HiPer P&R is optimized for the needs of big-Analog/little-Digital mixed signal designs on typical analog process nodes.
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ClioSoft’s Ranjit Adhikary to Speak on Design Reuse and IP Management at EDPS
Last week — ClioSoftClioSoft will participate in IP track, speaking on the need to move away from the traditional definiton and usage of IP
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Motor Driver from Microchip is Automotive AEC-Q100 Qualified, Highly Integrated and Compact; Provides High Performance and High Current
2 weeks ago — Microchip TechnologyCost-Effective MCP8063 is World’s First 1.5 Ampere, Three-Phase Brushless DC, Sinusoidal Motor Driver in a 4×4 mm Package With the AEC-Q100 Quality Certification
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New EDA webcast announced: EDA Solutions for Next-Generation Designs Many indus…
Posted January 22, 2013 — By EDA Digest -
Standing room only for session on ARM 64-bit architecture – enterprise/server/bi…
Posted November 01, 2012 — By EDA Digest - Newer Blog Posts Older Blog Posts
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TSMC at ARM Techcon 2012
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Mentor Graphics at ARM Techcon 2012
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Cadence at ARM Techcon 2012
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GLOBALFOUNDRIES at ARM Techcon 2012
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New Surface RT tablets getting lots of attention at ARM booth. Snappy performanc…
Posted October 31, 2012 — By EDA Digest -
Big forked stick + sling + vengeful stuffed avians + accelerometer + strain gaug…
Posted October 31, 2012 — By EDA Digest -
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Oski Technology to Host Latest Decoding Formal Club for Formal Verification Enthusiasts
2 weeks ago — Oski TechnologyApril 21 Agenda Includes Panel on Building Formal Team, Presentation on Formal Test Planning
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Sonics Augments SpyGlass(r) IP Kit Verification Flow with SpyGlass Constraints – Sonics Ensures Highest Possible Quality for On-Chip Network Configurations
Last month — Atrenta Inc.Atrenta and Sonics announced today that Sonics has adopted Atrenta’s SpyGlass Constraints tools to enhance its semiconductor intellectual property (IP) signoff flow.
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EDA News
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Oski Technology to Host Latest Decoding Formal Club for Formal Verification Enthusiasts
2 weeks ago -
Semtech LoRa(tm) Platform Selected by KERLINK For First Internet of Things Long-Range Gateway
2 weeks ago -
S3 Group Launches the Industry’s Smallest, Most Efficient High-Speed ADC
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WT Microelectronics Invests in New Design Center to Develop System Solutions for Customers Using Microsemi’s Mainstream FPGA Products
Last month -
Sonics Augments SpyGlass(r) IP Kit Verification Flow with SpyGlass Constraints – Sonics Ensures Highest Possible Quality for On-Chip Network Configurations
Last month -
Uniquify’s CTO to Describe How to Manage Manufacturing Test During CDN Live Silicon Valley
Last month -
Colo Engineer Firm Releases next Development Platform Advantage ZigBee to Bluetooth Smart 4.0 Core
4 months ago
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