Embedded Shows: Electronica, DesignEast/West, Embedded World, DAC

ADLINK Technology to unveil ATCA, CompactPCI, COM Express and COM products at Embedded World 2012, Nuremberg

February 28, 2012 — ADLINK Technology

ADLINK Technology's key products for 2012 include processor blades, cost-effective high performance 3U and 6U products, Computer-on-Modules and an ARM module featuring the new COM standard.

ADLINK Technology to unveil ATCA, CompactPCI, COM Express and COM products at Embedded World 2012, NurembergADLINK Technology will amongst others present an array of new products at this years’ Embedded World in :

Next generation ATCA tele/data-communications processors

ADLINK Technology offers complete platform solutions with high-density processing power, fast data throughput and intelligent system management that are designed for next-generation tele/data-communications equipment manufacturers. Based on the future Intel® Xeon® processor E5 family, ADLINK's latest ATCA processor blades provide 10 Gigabit Ethernet, eight memory sockets for up to 128GB of DDR3, and dual 10GBASE-KXK Fabric Interface channels.

3U and 6U CompactPCI components for cost-effective, high performance platforms

ADLINK Technology provides a complete line of 3U and 6U CompactPCI blades along with a wide range of peripheral cards and modules to provide cost-effective, high performance platforms for telecommunications, military and industrial automation applications. Our latest CompactPCI offerings are based on the future 3rd Generation Intel® Core™ processor family, supporting dual channel DDR3 ECC memory, three independent displays (DisplayPort, DVI, HDMI, VGA), USB 3.0, PCI Express Gen3, remote management and Trusted Platform Module (TPM) .

COM Express® computer-on-modules for graphics, processing and rugged applications

ADLINK’s full COM Express® products includes Basic and Compact size Type 2/6 modules, and Mini size Type 1/10 modules. The Express-HR is a COM Express® module with the new Type 6 pinout which provides three Digital Display Interfaces (DDI) for flexible graphics output in embedded applications. It features the Intel® Core™ i7 processor with QM67 chipset, PCI Express® Gen2 and SATA 6 Gb/s. The Express-GFC, a Compact COM Express® Type 6 module, is based on the AMD Fusion™ G-Series processor and supports two DDI outputs. The nanoX-TC is a Mini size Type 10 module with Intel® Atom™ Processor E6xx for mobile applications.

For harsh environments, ADLINK also presents its Extreme Rugged™ COM Express® modules that can withstand high shock/vibration conditions, with an extended -40°C to +85°C operating temperature range.

The new COM standard – ARM

ADLINK will present an ARM module live demo featuring the new Computer-on-Module (COM) standard developed by in consultation with ADLINK. This new COM standard utilizes the 314-pin MXM 3.0 connector and is intended for ultra low-power embedded architecture platforms. ADLINK is developing an entire line of products that will provide a very slim and low profile solution with ARM/RISC and SOC based ultra low-power processors. The standard specifically targets new fast growing markets such as handheld devices and industrial tablets, but will also provide advantages for more traditional applications such as industrial control and data communications.

The ADLINK display can be found at the Exhibition Center in Nuremberg Germany, Booth 532 in Hall 1, from February 28th to March 1st.


Subscribe to ESC updates