Carbon Design Systems® Inc., the leading supplier of virtual platform and secure model solutions, today introduced the Carbon Performance Analysis Kit (CPAK) family for accelerating the analysis, optimization and verification of system-on-chip (SoC) performance.

CPAKs enable architects and engineers to begin analyzing performance and power within hours of installation, and months before tapeout, reducing overall time-to-market pressures and minimizing the risk of a complete re-design. They can be customized using models from Carbon's IP Exchange model portal, SystemC or Carbon Model Studio.

The CPAK family for ARM® Cortex™ A-Series processors contains reference hardware and software designs along with analysis and debug software for the Cortex-A9, Cortex-A15 and Cortex-A7 cores, and the ARM big.LITTLE™ subsystem.

It comes pre-configured with bare-metal initialization software, Linux or Android OS for analyzing, optimizing and verifying performance and power. In addition, the CPAK Family is pre-configured with the multicore task migration software layer between the big.LITTLE processing cluster, which includes ARM Cortex-A15 MPCore and Cortex-A7 MPCore processors, and the client OS.

"Designers often attempt to use 85-90% cycle-accurate solutions that they claim are good enough for system analysis," comments Joe Tatham, Carbon's vice president of engineering. "What typically happens, though, is that model is only 50-60% accurate for certain areas. Designers are making multi-million dollar decisions based upon data that's about as accurate as the flip of a coin. Carbon is the only vendor that offers 100% cycle-accurate models, where design teams can guarantee performance results will match the final silicon, minimizing the risk of a re-design."

Demonstrations During DAC

Carbon will demonstrate the CPAK for ARM big.LITTLE at this year's Design Automation Conference (DAC) in San Francisco's Moscone Center June 4-6. Carbon will exhibit and offer presentations in the ARM Connected Community Pavilion, Booth #802.

Availability

The CPAK Family for ARM Cortex Processors will be available in bare metal and Linux configurations in the second quarter of calendar year 2012, and in Android configurations in the second half of calendar 2012.

Details about Carbon's Performance Analysis Kit Family, including compatibility with ARM tools and popular software debuggers, can be found at: www.carbondesignsystems.com/cpak.

About Carbon Design Systems

Carbon offers the industry's only unified virtual prototype solution along with the leading solution for accurate IP model creation. Carbon virtual prototypes can execute at 100s of MIPS and with 100% accuracy to enable application software development, detailed architectural analysis and secure IP model distribution. Its solutions are based on open industry standards, including SystemC, IP-XACT, Verilog, VHDL, OSCI TLM, MDI, CASI, CADI and CAPI. Carbon's customers are systems, semiconductor, and IP companies that focus on wireless, networking, and consumer electronics. Carbon is headquartered at 125 Nagog Park, Acton, Mass., 01720. Telephone: (978) 264-7300. Facsimile: (978) 264-9990. Email: info@carbondesignsystems.com. Website: www.carbondesignsystems.com.

EVE, the leader in hardware/software co-verification, confirmed today that Texas Instruments Incorporated used its ZeBu-Server (for Zero Bugs) hardware-assisted verification platform to accelerate development of its embedded software for the OMAP™ 5 platform.

"The EVE team and ZeBu-Server played a critical role in helping us enable Android software on our OMAP 5 platform," says Vincent Verfaillie, development platforms and tools manager, TI. "We were able to boot the Android OS on the OMAP5430 processor mapped onto ZeBu-Server in about seven minutes, which is more than 30 times faster than EVE's closest competitor. Our TI team is very satisfied with the ZeBu technology, in addition to EVE's pre- and post-sales support."

ZeBu-Server combines fast speed of execution, scalable capacity that ranges from a few million to more than one billion ASIC-equivalent gates, along with design debugging capabilities in a small footprint. Utilizing ZeBu-Server, TI was able to cut the development of the OMAP5430 processor's embedded software by six to nine months.

In 2011, TI worked to develop embedded Android software for the smart multicore OMAP5430 processor. ZeBu-Server served as a key tool in TI's Android Development. Android was up and running on the first OMAP5430 processor less than two weeks after engineering samples became available. As a result, TI was able to offer public demonstrations of the Android OS booting up on the OMAP 5 processor at CES in January 2012.

"TI's success highlights real-world evidence of ZeBu-Server's effectiveness," adds Luc Burgun, EVE's chief executive officer and president. "Accelerating embedded software development is imperative in a highly competitive environment and we are proud to provide ZeBu-Server for accelerated product designs."

About EVE

EVE is the worldwide leader in hardware/software co-verification solutions, offering fast transaction-based co-emulation and in-circuit emulation, with installations at five of the top six semiconductor companies. EVE products shorten the overall verification cycle of complex integrated circuits and electronic systems designs, and can be integrated with transaction-level ESL tools and software debuggers, target hardware systems, as well as Verilog, SystemVerilog and VHDL simulators. EVE is a member of OCP-IP and the MIPI Alliance, along with ARM, Mentor Graphics, Real Intent, Springsoft and Synopsys Partner programs. Its United States headquarters is located in San Jose, Calif. Corporate headquarters is in Wissous, France. Other offices are located in India, Japan, Korea, Taiwan and Tunisia. Visit EVE online at: www.eve-team.com.

Valencia, CA; May 1, 2012: Cicoil's Hi-Flex Single Conductor Silicone Power Cables provide extreme all-weather flexibility, perform exceptionally well when exposed to chafe and severe heat & cold (-65°C to +260°C), and excel in tight bend radius applications. This combination of features, make Cicoil’s highly reliable silicone power cable the ideal choice for mission critical military helicopter applications.

Cicoil’s halogen-free and flame retardant (UL 94 V-0) design is naturally more flexible than other types of single conductor power cable, and is immune to extreme shock, vibration, mechanical stress, salt water, sunlight, acid rain, ice, corrosion, coarse sand, UV light, weld spark, ozone, corrosion, radiation, and most chemicals.

Cicoil's proprietary crystal-clear silicone encapsulation needs no external "armor" or conduit for protection, is tear-resistant and will not deform or wear during a lifetime of more than 10 million cycles, even under tight bending radius and high speed motion conditions. Cicoil's ultra-durable silicone is "self-healing" from small punctures and cable jacket damage can easily be repaired in the field.

Rated for voltages up to 42,000 Volts DC, Cicoil’s Hi-Flex Single Conductor Power Cables (4 AWG to 30 AWG) are available from stock in continuous lengths, cut to order, or as assemblies, complete with lugs or connectors of your choice, 100% tested and inspected. In addition, Cicoil offers anti-friction coatings, low smoke-zero halogen, custom colors and lower/higher voltage designs by request.

Cicoil's UL Recognized, CE Conforming and RoHS & REACH Compliant cables are manufactured in an automated, climate controlled environment, and exceed the NASA 1124 outgassing specifications for space use and vacuum requirements.

Cicoil has been a leader in designing and manufacturing high performance flat cable assemblies for over fifty years. The company's unique silicone coated flat cables provide high flexibility, extremely long life, and they can withstand temperature extremes from -65 degrees to +260 degrees Celsius. Cicoil's flat cables are used in thousands of demanding applications; including aircraft fuel control cells, semiconductor automation, and the Space Shuttle. Cicoil designs and manufactures its cable and cable assemblies in an automated facility in Valencia, California. Cicoil's quality assurance system is certified to the ISO 9001 (AS9100) standard. Visit www.cicoil.com for more information, or call 661-295-1295 to speak to an application engineer.

NEW ORLEANS, May 7, 2012 -- CTIA Wireless – PT (NASDAQ: PTIX), a leading global supplier of advanced network communications, today announced its Universal Diameter Router (UDR), broadening the company's SEGway Signaling line of IP-native products. UDR provides essential functions of centralized core and edge routing for Diameter Protocol elements widely used in the all-IP, service-oriented, IMS and Long Term Evolution (LTE) architecture networks. These functions include:

Diameter Routing Agent (DRA) as specified by 3GPP

Diameter Edge Agent (DEA), the GSMA specification

Diameter Protocol per IETF specifications

Interworking Function (IWF) as per 3GPP

As IMS and LTE infrastructures are deployed, new elements such as policy servers, gateways, session controllers, and charging systems are interconnected and interwork via Diameter Protocol to exchange network information. The rapid proliferation of these adjunct network devices, together with the exploding appetite for extreme bandwidths enabled by LTE and IMS, result in the need to manage enormous increases in signaling traffic within the network. The sheer volume and complexity of Diameter traffic places staggering demands on core signaling elements; with SEGway's IP-native, built-for-purpose platform, service providers attain scalable high performance with powerful multi-core processors, 10Gb point-to-point backplane speeds and 40Gb uplink. The flexible routing engine and advanced screening capabilities provide the ability to route and screen on any parameter in the message. Architected for extensibility as well as straightforward evolution to future Diameter applications, this high-powered platform makes SEGway UDR ideal for Next-Generation Network (NGN) deployments.

"The SEGway UDR fully leverages our substantive portfolio of IP-centric and advanced network routing hardware and software technologies with the expertise gained by our long history of deploying carrier grade network solutions," said John Slusser, President and CEO of PT. "It is this unique combination of technology and real-world network experience that results in the SEGway UDR being a best-of-breed solution for a wide range of Diameter signaling requirements in Next-Generation Network architectures."

Patt Rice, PT's Senior VP, Sales, Marketing and Service, commented, "PT has been diligently monitoring the industry to determine the volume and capacity requirements in the Evolved Packet Core as service providers migrate to LTE. Ever mindful of carriers' OPEX concerns, we are convinced PT's UDR is the right solution in the right market conditions. It allows service providers to leverage existing networks' infrastructure on their path to LTE using a richly featured and precision-tuned, cost-conscious platform, avoiding the expense and drawbacks of some early off-the-shelf entries. With SEGway, the Next-Gen service provider benefits through Simply Smarter Signaling, the PT advantage."

PT's SEGway Signaling products are deployed in over one thousand locations, providing the Signaling backbone for many of the world's premier wireless networks. With its small footprint and high throughput capacity, SEGway is widely recognized as the industry's leading signaling architecture, with the ability to scale from small to very large networks.

Online Resources

pt.com/products/ngn-applications/universal-diam[...]

About PT (www.pt.com)

PT (NASDAQ: PTIX) is a global supplier of advanced network communications solutions to service provider, government, and OEM markets. PT's portfolio includes IP-centric network elements and applications designed for high availability, scalability, and long life cycle deployments. The industry-leading Monterey MicroTCA and IPnexus Application-Ready Platforms anchor the company's broad range of offerings. PT's SEGway Signaling Solutions provide affordable, high density signaling, advanced Diameter routing for LTE and IMS applications, IP migration, gateway capabilities, and core-to-edge distributed intelligence, as well as features such as Number Portability and SMS Spam Defense. The SIP-based Xpress product family enables service providers to provision a wide range of revenue generating and churn-reducing applications in either cloud-based or captive architectures. PT is headquartered in Rochester, NY and maintains sales and engineering offices around the world.

Eching, Germany, April 26th, 2012 – Kontron today announced the launch of its new COM Express® compact Computer-on-Module COMe-cCT6. It is the company’s energy efficient entry-level multicore module based on next-generation Intel® Atom™ processors with 32 nm technology. The module is available in three multicore performance levels up to 2x 1.86 GHz and offers an increased performance per watt ratio: Compared to platforms based on the second generation of Intel® Atom™ processors it offers twice the graphics capability, up to 28% higher processor performance and half of the processor thermal design power (TDP). The COM Express® pin-out type 6 definition enables the module to provide these increased capabilities via a scalable interface range that offers suitable options for both cost and power sensitive applications alike.

The module’s space-saving COM Express® compact form factor (95 mm x 95 mm) is ideal for designs requiring the full range of interfaces provided by the COM Express® pin-out type 6 in a small solution. Developers of intelligent systems who need an array display support stand to benefit module’s ready-to-use interfaces that include three Digital Display Interfaces such as 2x DisplayPort, HDMI/DVI and 24 bit LVDS. Integrated decoding hardware within the module keeps processor load to a minimum when decoding 1080p videos which means that OEMs can even use it for entry-level digital signage. Another plus is the platform’s enhanced power management features including Intel® Deeper Sleep and Intel® Rapid Start Technology all of which further helps to reduce power consumption and enable fast resume from standby mode for intermittent usage models like those found in modern KIOSK systems. In combination with the Intel® Smart Connect Technology, the new Kontron COMe-cCT6 also enables connected usage scenarios where an instant Internet connection is available as soon as the application is (re)activated and also allows for constant updates even while in standby. Therefore, the Kontron COMe-cCT6 is also an ideal building block for connected devices that are becoming more and more prevalent. At the same time it also helps in a time and cost-efficient system design, as the overall low power consumption enables simple cooling solutions even for fully sealed and rugged designs in markets such as medical, POS/POI, and industrial automation.

Feature set in brief

The new Kontron COMe-cCT6 Computer-on-Modules are equipped with 2x 1.6 GHz or 2x 1.86 GHz Intel® Atom™ processors (N2600, N2800 and D2550), the Intel® NM10 Express chipset, and up to 4 GB of fast on-board DDR3 800/1600 system memory. The integrated Intel® Graphics Media Accelerator 3600/3650 enables 1080p playback of MPEG4 Part 2, VC-1, WMV9 and H.264 videos with minimum processor load. Furthermore, the new module provides HDCP support via HDMI 1.3a and DisplayPort 1.1, enabling BluRay playback. Additionally, OEMs can connect monitors also via the common LVDS and VGA interfaces. Intel® High Definition Audio complements the multimedia features. Furthermore, the Kontron COMe-cCT6 offers two SATA II 300MB/s interfaces, eight USB 2.0 ports, Gigabit Ethernet, and three PCI-Express x1 lanes for custom extensions.

The Kontron COM Express® compact Computer-on-Module COMe-cCT6 supports a wide range of operating systems including Wind River VxWorks 6.8, Linux, Windows XP, XPe, WEC 7 and WES 7 where Windows 8 support is planned. First samples of the Kontron COMe-mCT6 are available now and series production will start in June

For more information on the Kontron COM Express® compact Computer-on-Module COMe-cCT6, please visit:

kontron.com/products/computeronmodules/com+expr[...]

For more information on Computer-on-Modules form factor COM Express® compact please visit:

www.kontron.com/products/computeronmodules/com+[...]

For more information on COM Express® Computer-on-Modules please visit: www.kontron.com/mysafechoice

About Kontron

Kontron is a global leader in embedded computing technology. With more than 30% of its employees in Research and Development, Kontron creates many of the standards that drive the world’s embedded computing platforms. Kontron’s product longevity, local engineering and support, and value-added services, helps create a sustainable and viable embedded solution for OEMs and system integrators. Kontron works closely with its customers on their embedded application-ready platforms and custom solutions, enabling them to focus on their core competencies. The result is an accelerated time-to-market, reduced total-cost-of-ownership and an improved overall application with leading-edge, highly-reliable embedded technology.

CHELMSFORD, Mass.  April 23, 2012  Mercury Computer Systems Inc. (NASDAQ: MRCY, www.mc.com), a trusted provider of commercially developed application-ready ISR and EW subsystems for defense prime contractors, announced the Ensemble® Series 6U OpenVPX™ LDS6524 and the 3U OpenVPX SBC3512 modules based on the 22 nanometer 3rd generation Intel® Core™ processor family (formerly codenamed “Ivy Bridge”). Utilizing the quad-core Intel® Core™ i7-3615QE processor for the LDS6524 and the quad-core Intel® Core™ i7-3612QE processor for the SBC3512, the new OpenVPX modules deliver greatly improved performance per watt, a key design metric for high-performance defense and aerospace applications.

For applications that require the absolute highest performance, the 3rd Generation Intel Core processor family supports a higher maximum clock speed at the same power dissipation compared to prior generation products. Customers that have field-tested and deployed the 2nd Generation Intel Core™ i7 processor-based products from Mercury can now upgrade to the new LDS6524 or SBC3512 without expensive software recoding or system-level redesign. Additionally, for applications that require the absolute lowest power, performance can be controlled with advanced software features in the Intel Core processor that greatly reduce power dissipation dynamically during run-time.

“Offering optimized building blocks and staying in lockstep with the latest technologies is critical for our customers to rapidly deploy best-of-breed defense and aerospace applications,” said Steve Patterson, Vice President of Defense Product Management, Mercury Computer Systems. “Mercury is unique in that we deliver both Intel mobile-class and Intel server-class based products and we are committed to offering the latest Intel processors as they become available. With this capability, customers can mix and match server and mobile-class processor technologies to achieve a 3-5x system performance improvement,” continued Patterson.

“The 3rd generation Intel® Core™ processor family used in Mercury’s new OpenVPX rugged products is based on the 22 nanometer process technology and brings increased performance at the same power dissipation of the previous generation,” said Matt Langman, director of marketing, Intel Intelligent Systems Group. “Higher performance combined with the Intel® AVX processing capability on the four cores meets signal processing requirements as well as the computing needs of traditional, embedded real-time applications.”

Mercury offers a variety of validated building block types so customers can configure OpenVPX systems to optimize their specific application. The new mobile-class LDS6524 can be combined with Mercury’s recently announced server-class Intel® Xeon® E5-2600 family-based HDS6601 to maximize the number of processors in the OpenVPX system while also configuring the right amount of I/O for the application. Mercury offers a full ecosystem of building blocks for the most demanding applications. Specialty processors such as FPGA- and GPGPU-based Mercury modules can be added to the system to enable the best technology for each stage of the signal processing chain. These modules are interconnected with industry-standard I/O, based on Mercury’s high-speed, low-latency Protocol Offload Engine Technology (POET™), enabling a software-compatible ecosystem for systems with unmatched size, weight, and power (SWaP) characteristics.

Customers recognize application software code preservation is important for both rapid time to market and lower life cycle cost. Since the LDS6524 and SBC3512 are software-compatible with previous product generations and are supported by Mercury’s MultiCore Plus® software development environment, customers preserve their software investment. MultiCore Plus delivers high-performance data movement interfaces and processing libraries with industry-standard open interfaces. Examples include the embedded computing industry’s fastest interconnect software based on OpenMPI/OFED with direct access to POET™ DMA engines and the industry renowned Scientific Application Library (SAL) with new AVX optimizations. Because the modules are based on open architecture, third party products such as Mentor Graphics’ VSIPL++ are also available. Additionally, customers can develop code and migrate it seamlessly from Mercury’s workstation-based Virtual Multi-Computer (VMC) simulator to the OpenVPX target modules, enabling quick deployment of lab-based algorithms.

The LDS6524 and SBC3512 are available now and can be configured in air-cooled or conduction-cooled rugged versions.

For more information on the Ensemble 6U LDS6524 and 3U SBC3512 modules, visit mc.com/Intel, or contact Mercury at (866) 627-6951 or info@mc.com.

Mercury Computer Systems, Inc. – Where Challenges Drive Innovation®

Mercury Computer Systems (www.mc.com, NASDAQ: MRCY) is a best-of-breed provider of open, commercially developed, application-ready, multi-INT subsystems for defense prime contractors. With over 30 years of experience in embedded computing, superior domain expertise in radar, EW, EO/IR, C4I and sonar applications, and more than 300 successful program deployments including Aegis, Global Hawk and Predator, Mercury’s Services and Systems Integration (SSI) team leads the industry in partnering with customers to design and integrate system-level solutions that minimize program risk, maximize application portability and accelerate customers’ time to market.

Mercury is based in Chelmsford, Massachusetts, and serves customers worldwide through a broad network of direct sales offices, subsidiaries and distributors.

New VPX3-1257 3U OpenVPX™ SBC features Intel® Core™ i7-3612QE processor

ASHBURN, VA – April 23, 2012 -- Curtiss-Wright Controls Defense Solutions (CWCDS), a business group of Curtiss-Wright Controls, enhances its rugged, high performance OpenVPX Intel® processor-based single board computer (SBC) product line with the introduction of the new VPX3-1257, its first OpenVPX™ SBC designed with the new quad-core 3rd generation Intel® Core™ i7-3612QE processor. The VPX3-1257 is the latest member of CWCDS's family of next generation multi-core Intel® architecture-based SBCs, and builds on the success of the earlier VPX3-1256 that was based on the 2nd generation Intel® Core™ i7-2715QE processor. The new Intel Core i7-3612QE processor delivers a significantly improved thermal profile, enabling greater cooling for the extended temperature ranges demanded by the most rugged Mil/Aero/Gov customer.

"CWCDS is proud to have built one of our industry’s leading Intel® Core™ i7 processor-based product families. This 3rd generation Intel Core processor allows us to extend that family of products by creating a 3U OpenVPX SBC with a thermal footprint never before obtained with earlier generation processors," said Lynn Bamford, senior vice president and general manager of Curtiss-Wright Controls Defense Solutions. "With Intel's commitment to long life-cycle supply, this advanced low-power processing engine will drive a new generation of higher performance and power efficient compute intensive applications."

“The 3rd generation Intel® Core™ i7 processor family, supporting a reduced power footprint, quad core options, and ECC are ideally suited for ruggedized applications in the aerospace and defense single board computer (SBC) market segment,“ said Matt Langman, director of product marketing, Intel Intelligent Systems Group. “By announcing longer term availability of this high-performing, integrated processor family, Intel is giving our customers options for development of innovative and dependable long-term solutions.”

The VPX3-1257 is a full-featured 3U OpenVPX SBC, designed for harsh-environment, air and conduction-cooled aerospace and defense applications. Additionally, the VPX3-1257 is fully backwards compatible with the popular VPX3-1256 based on the Intel® Core™ i7-2715QE processor (formerly known as “Sandy Bridge”). The new Intel Core i7-3612QE processor, with its reduced power at a similar clock speed, delivers the improved performance per watt required by size, weight, and power (SWaP) constrained applications. Designed with a comprehensive set of features, including on-board I/O, x8 PCIe Gen2 fabric, and XMC mezzanine module expansion, the VPX3-1257 satisfies the most demanding fielded applications from unmanned aerial and ground vehicles, tactical aircraft, and armored vehicles to rugged naval systems.

x16 PCIe Variant to Complement GPGPU Processing

A variant SBC, the soon to be released VPX3-1267, will offer an x16 PCIe alternative to the VPX3-1257’s x8 PCIe architecture. The unique VPX3-1267 will provide a high performance SBC complement to CWCDS’ industry leading VPX3-491 GPU Application Accelerator, the first DSP engine based on the NVIDIA® Fermi architecture with 240 CUDA™ cores. The VPX3-491 functions as a co-processor attached to a host Intel® processor board and takes advantage of a high-speed PCIe Expansion Plane. The combination of 3rd generation Intel Core processors, gen2 PCI Express interconnects and 240 NVIDIA CUDA cores raises the performance bar for compact systems for demanding military digital signal processing (DSP) applications such as C4ISR, EO/IR, and SatCom.

Comprehensive I/O and Expansion Features

The VPX3-1257 (and the upcoming VPX3-1267 x16 PCIe variant) is offered in a full range of air- and conduction-cooled configurations. Performance features include 8/16GB of high-bandwidth DDR3 SDRAM (1333 MHz), and a rich complement of high-speed I/O, including dual Gigabit Ethernet, USB 2.0 ports, DVI, SATA and an XMC site supported with eight (8) lane of PCI Express (PCIe).

Extensive Software Support

The VPX3-1257 is supported with an extensive suite of software including support for Windows® WES7, Linux®, and VxWorks® operating environments.

The VPX3-1257 is the latest addition to CWCDS’s broad family of Intel® architecture-based high density SBCs. It complements CWCDS’s wide range of Network Switches/Routers, Digital Signal Processors, Graphics and Communications and I/O products. For more information on the VPX3-1257, please visit www.cwcdefense.com.

For additional information on CWCDS please visit: www.cwcdefense.com.

Sales & Editorial Contacts

For editorial information regarding Curtiss-Wright Controls Defense Solutions products or services, contact John Wranovics, public relations director, Curtiss-Wright Controls, Tel: (925) 640-6402; email: jwranovics@curtisswright.com.

Sales inquiries: Please forward all Sales and reader service inquiries to Jerri-Lynne Charbonneau, Curtiss-Wright Controls Defense Solutions, Tel: (613) 254-5112; Fax: (613) 599-7777; e-mail: defensesales@curtisswright.com.

About Curtiss-Wright Controls Defense Solutions

Curtiss-Wright Controls Defense Solutions (CWCDS) is a long established technology leader in the development of rugged electronic modules and systems for defense applications. CWCDS serves as a technology and integration partner to its customers, providing a full range of advanced, highly engineered solutions from modular open systems approaches to fully custom optimized solutions. Our unmatched capabilities and product breadth span from industry standard based COTS modules to complete electronic subsystems. The company’s modules and systems are currently deployed in a wide range of demanding defense & aerospace applications including C4ISR systems, unmanned subsystems, mission computing, fire control, turret stabilization, and recording & storage solutions. Additionally, the company’s broad engineering capabilities combine systems, software, electrical, and mechanical design expertise with comprehensive program management and a broad range of life-cycle support services. For more information visit www.cwcdefense.com.

About Curtiss-Wright Controls, Inc.

Headquartered in Charlotte, NC, Curtiss-Wright Controls is the Motion Control segment of Curtiss-Wright Corporation. With manufacturing facilities around the world, Curtiss-Wright Controls is a leading technology-based organization providing niche motion control products, subsystems and services internationally for the aerospace and defense markets. For more information, visit www.cwcontrols.com.

SUNNYVALE, April 23, 2012 – GridIron® Systems, a pioneer in Big Data acceleration, today introduced OneAppliance™, a comprehensive suite of solutions designed especially for accelerating Big Data analytics, based on engineered systems that match the unique workload characteristics of Big Data to Multi Level Cell (MLC) Flash for optimal performance. For the first time, GridIron’s OneAppliance solutions enable enterprises to use the same infrastructure to seamlessly combine structured, unstructured or mixed Big Data processing. A GridIron OneAppliance system reduces complexity, while increasing computing performance, bandwidth, and scalability so IT departments can protect their infrastructure investments and utilize resources in a more cost-effective manner.

“As more organizations want to harness the power of ‘Big Data’ to drive business improvements, new IT infrastructure challenges to support it are emerging,” said Mark Peters, senior analyst at Enterprise Strategy Group. “GridIron recognizes the need in Big Data environments for a ‘balanced data delivery infrastructure’ as a result of the typical demand for a mix of structured and unstructured; and to address this need, its OneAppliance suite promises to relieve serious data-access bottlenecks by better balancing processing and storage, and thereby helping organizations to deliver on the potential of Big Data.”

The OneAppliance suite represents a significant breakthrough for organizations running clustered applications that often struggle to deliver performance under concurrent workloads and fail to utilize the full capabilities of hundreds, or even thousands, of physical servers and storage devices. In contrast, GridIron’s OneAppliance provides up to twenty times the bandwidth of even the fastest Flash solutions available today and can reduce space and power consumption by up to 60% while reducing the total cost of ownership for Big Data infrastructure by 75%.

GridIron’s new FlashCube™, iNode™ and RackPack™ rack-mounted systems are part of the OneAppliance suite of solutions built for unified Big Data analytics:

OneAppliance FlashCube – Ultra-high Bandwidth Acceleration for SAN-based Infrastructure

The GridIron OneAppliance FlashCube is the first ultra-high bandwidth unified data store for the aggregate read and write performance demands of Storage Area Network-based clustered applications. Combined with the GridIron TurboCharger, it provides a complete solution for the shared demands of Oracle Real Application Clusters (RAC), including Database Smart Flash Cache and intermediate TEMP stores, to speed up Extract/Transform/Load (ETL) or join operations. The FlashCube is intended for seamless deployment in Oracle Automatic Storage Management environments. It delivers industry-leading performance and bandwidth, with 1 million Input/Output operations per second (IOPS), bandwidth in excess of 10 Gigabytes per second (GB/s) and 25 to 100 terabytes (TB) of Flash capacity.

OneAppliance iNode – Compute-integrated Big Data Appliance

The GridIron OneAppliance iNode integrates high-performance compute with engineered high-bandwidth Flash data store to offer the industry’s first all-Flash Big Data appliance. This architecture removes the limitations of PCIe attached Flash that typically tops out at 2 GB/s with densities well below 5 TB of capacity. The iNode has 40 cores with 2-way hyper-threading with up to 1 TB of Random Access Memory and 100 TB of Flash that is capable of 1.5 million IOPS and 20 GB/s bandwidth. It’s the highest performance server Flash system available in the industry today. This revolutionary approach breaks through the imbalance of today’s server-Flash solutions by providing unprecedented scale and bandwidth to meet the demands of multi-core servers. The iNode is a single 10 rack unit system that can simplify and consolidate sprawling clusters of storage and servers without sacrificing performance. This system is designed for data marts, data warehouses, Online Analytical Processing (OLAP), and Enterprise Resource Planning environments. It can be used as a Hadoop node or as a cloud-container for virtualized SQL or NoSQL clusters, delivering improved resiliency and manageability.

OneAppliance RackPack – Scale-out All-Flash Big Data Appliance for Hadoop and Oracle RAC

The GridIron OneAppliance RackPack is designed for data processing needs beyond 100 TB and reaching into Petabytes. This unified compute and storage system outperforms all other vendors’ offerings with up to 40 GB/s bandwidth and 4 million IOPS. This scale-up and scale-out system is designed for the most demanding clustered Big Data and High Performance Computing applications. A RackPack can have up to 40 state-of-the-art Sandy Bridge servers (supplied by GridIron’s server partners), up to 250 TB of Flash and can run a Hadoop cluster, or 32-node Oracle RAC, or a combination of Hadoop/Hbase/SQL Relational Database Management System to house a customer-specific data processing flow. The unique stateless compute cluster can combine shared-nothing and shared-everything processing in one appliance to provide unprecedented flexibility in mixing applications and backup processes.

The OneAppliance FlashCube, iNode and RackPack will be showcased at Collaborate 2012 from April 23 through 26 (booth #1615). All OneAppliance models are available for qualified customer evaluations starting May 2012. Additional information about OneAppliance solutions is available online at www.gridironsystems.com

About GridIron Systems

GridIron Systems is a Big Data Acceleration company based in Sunnyvale, California. Formed by a team of networking, storage and SAN innovators, it has focused on bringing the benefits of new technologies like solid state disk to improve data center performance and costs with the LEAST amount of operational disruption. GridIron has 24 patents pending in areas related to big data storage, access-behavior analysis and management. GridIron offers the most comprehensive solutions to speed up multi-terabyte databases including clustered and virtualized environments at a fraction of the cost of alternatives. Additional information is available at www.gridironsystems.com. Follow GridIron on Twitter: @gridironsystems and blog: www.bigdatafasttracked.com.

NAB SHOW, Las Vegas – April 17, 2012 – Advantech (TWSE: 2395.TW), a leading designer and manufacturer of multicore media processing platforms, and Ittiam Systems Private Limited, headquartered in Bangalore, India, a technology company singularly focused on embedded media-centric systems, announced the availability of a new high-density audio transcoding platform on Advantech’s DSPC-8681 card based on four TMS320C6678 multicore DSPs from Texas Instruments Incorporated (TI). This platform sets new levels of performance in channel density and transcoding throughput in a half-length PCIe form factor.

“The combination of Ittiam’s production-proven audio processing codecs optimized for TI’s C6678 multicore DSPs and Advantech’s PCIe cards results in a highly scalable solution for OEMs,” said David Lin, Director DSP Solutions, Advantech. “The availability of such a high-performance audio processing platform in an industry-standard form factor will help our customers accelerate integration and development times much faster than before.”

Advantech’s DSPC-8681 is capable of transcoding multiple channels of audio and video, and it provides the hardware foundation for a wide variety of media codecs.

"The DSPC-8681 represents a powerful platform that enables high-quality and very high-channel transcoding for infrastructure needs," said Rohit Bhuva, Ittiam Vice President, Business Development, Americas. "Using Advantech’s platform allows us to deliver Ittiam’s Broadcast Solutions to customers as a complete package with a shorter time to market."

Ittiam’s software systems for broadcast applications are available for licensing as software development kits (SDKs) with defined application programming interfaces (APIs) on TI’s C667x multicore DSPs. The SDKs include a multimedia framework, middleware and codecs. The codecs include both highly optimized video and audio codecs for various formats and other video and audio processing algorithms. Running on Advantech’s DSPC-8681, Ittiam’s audio SDK can transcode 400+ channels of MPEG-1 Layer II to AAC.

Advantech's DSPC-8681 Media Engine integrates four of TI’s C6678 multicore DSPs, the PLX® ExpressLane™ PEX8624 PCIe Gen 2 switch, and the Xilinx XC3S200AN Spartan-3 FPGA to achieve the highest possible performance levels in a half-length PCIe form factor. High-speed inter-DSP communications provide low latency interconnects for scalable real-time multi-processing and connect to the host through a high-bandwidth PCIe x8 gen 2 interface. Based on the same design as the quad DSP card, Advantech’s DSPC-8682 extends the form factor to full length PCIe to accommodate eight of TI’s C6678 multicore DSPs, providing a significant leap forward in multicore density and processing performance.

Ittiam’s software framework will run on both the DSPC-8681 and DSPC-8682, allowing OEMs to build scalable solutions for a wide range of channel densities. By deploying solutions based on advanced media processing hardware today, OEMs can leverage the benefits of an all-software approach to extend their product lifecycles through new software enhancements in the future.

Advantech will be exhibiting at the NAB SHOW, Las Vegas Convention Center, Las Vegas, Nevada USA on April 16 – 19, 2012 on booth #SU11006.

Website: www.advantech.com/products/DSP-Processing-Platf[...]

NABSHOW, Las Vegas, April 16, 2012 – Advantech (TWSE: 2395.TW), a leading designer and manufacturer of multicore video processing platforms, announced a new family of breakthrough video processing products based on Texas Instruments’ (TI’s) TMS320C6678 multicore DSP. Advantech’s products will offer the true flexibility that an all software approach brings to video processing, but at lower power levels and in a smaller form factor than before.

“Advantech is accelerating the evolution of video platforms for OEMs through innovative DSP solutions which enable faster capture, encoding and processing at higher resolutions and data rates than ever before.” said David Lin, Director DSP Solutions, Advantech. “We’ll be demonstrating how our latest products, based on TI’s DM8168 DaVinci digital media processors and C6678 multicore DSPs, are setting new standards in video processing innovation and performance,” he added.

Advantech's DSPC-8681 Video Engine, a quad C6678 half-length PCIe, is capable of transcoding multiple channels of video. This breaks new ground with sufficient computing power to perform video encoding/decoding at resolutions up to 4k x 2k using the JPEG2000 codec. This is encoding or decoding in real-time and spanning four TI C6678 devices simultaneously.

"This new platform from Advantech offers our high performance video processors in robust industry-standard form factors, facilitating more rapid product development byour customers," said Sean Gardner, video iinfrastructure business manager, Texas Instruments. "By running the JPEG 2000 codec on Advantech’s DSPC-8681 we have been able to reduce the cost by 50%. This has the potential to enable new video applications at 4k x 2k resolution that previously would not have been feasible."

Advantech also announced today the DSPC-8682 video processing engine, a full length PCIe card with eight TI C6678 DSPs. Based on the same design as the quad DSP card, the DSPC-8682 provides a significant leap forward in multicore density and processing performance, The platform supports 2K/4K resolution with JPEG2000 or other standard codecs and will also provide the opportunity for future video processing needs such as handling of 8k video or adoption of future codec standards such as HEVC (H.265).

High-speed inter-DSP communications on both cards provides low latency interconnects for scalable real-time multi-processing and connections to the host through a high-bandwidth PCIe x8 gen 2 interface. The DSPC-8681 and DSPC-8682 are able to perform 1,024 and 2,048 GMAC (Giga Multiply-Accumulation operations per second) respectively using the embedded C66x DSP cores inside the C6678 device. This unrivalled raw computing power makes both products aperfect fit for advanced and complex video processing including deep-color pixel manipulation, HEVC/H.265 and advanced video processing algorithms.

Advantech collaborated with TI on a common set of drivers for both platforms which support TI’s foundational software framework. TI’s Multicore Software Development Kit (MCSDK) will run on the DSPC-8681, DSPC-8682 and future Advantech platforms allowing OEMs to deploy scalable product lines with quad or octal DSP boards. These platforms enable compact, low slot-count systems such as 1RU rack-mountable transcoding platforms or scale up to meet higher density needs requiring20-slot integrated systems with multiple board payloads.

Advantech also introduced today its new 8-channel video acquisitionboard, the DSPC-8662, based on four TI TMS320DM8168 media processors. The full length PCIe board supports SDI-SD/HD/3G and ASI inputs with an optional 4-channel HDMI video output for the delivery of multiple 1080p60 Full High-Definition (FHD) video streams with 4:2:0 pixel samples.

The flexibility of the DSPC-8662 makes it ideal for a wide range of video functions including acquisition, encoding, decoding, transcoding, video walls, multi-viewers and surveillance. Gigabit Ethernet provides network access while PCIe connectivity speeds integration into existing video carrier platforms. Available now withLinux and Windows based sample software code, the DSPC-8662 is designed to accelerate the development, integration and deployment of highly-efficient, high-density video solutions.

Advantech will be exhibiting these above products at the NABSHOW, Las Vegas Convention Center, Las Vegas, Nevada USA on April 16 – 19, 2012 in booth #SU11006.

Website: www.advantech.com/products/DSP-Processing-Platf[...]

Hoehenkirchen-Siegertsbrunn, April 2012 – Lauterbach, the leading manufacturer of hardware assisted microprocessor development tools, has launched a new debug probe which provides state-of-the-art debug features for the new high-performance Broadcom XLP processor family. TRACE32® now supports all Broadcom multi-core processor families XLP, XLR and XLS.

Lauterbach’s TRACE32® is a powerful high end debugging solution which is now available for the Broadcom XLP, XLR and XLS processor families. Full multi-core support and the included awareness for many real-time operating systems such as Linux give you a powerful debugging environment in all stages of software development and debugging – ranging from low level system bringup to high-end applications involving symmetric and asymmetric multiprocessing.

A very efficient and user friendly C and C++ HLL debugger in the TRACE32® PowerView software boost your development productivity. Finally, extremely flexible scripting features allow for full automatization to your needs. The TRACE32® tools can be connected to either Windows or Linux hosts via USB 2.0 or Ethernet 10/100/1000. A flash programming tool for the internal flash is included.

All TRACE32® PowerTools comply with the RoHS (Restriction of Hazardous Substances) directive.

About Broadcom Corporation

Broadcom Corporation (NASDAQ: BRCM), a FORTUNE 500® company, is a global leader and innovator in semiconductor solutions for wired and wireless communications. Broadcom® products seamlessly deliver voice, video, data and multimedia connectivity in the home, office and mobile environments. With the industry's broadest portfolio of state-of-the-art system-on-a-chip and embedded software solutions, Broadcom is changing the world by Connecting everything®. Find more information on www.broadcom.com.

About Lauterbach

Lauterbach is the world’s leading manufacturer of complete, modular microprocessor development tools with more than 30 years’ experience in the field of embedded designs. It is an international, well established company with blue chip customers in every corner of the globe and has a close working relationship with all the major semiconductor manufacturers. Besides the Headquarters in Höhenkirchen, Germany, the company has its own branch offices in the United Kingdom, Italy, France, on the East and West coasts of the United States, Japan and China. Highly qualified sales and support engineers are also available in many other countries.

Further information is available from www.lauterbach.com/pro_broadcom.html

MEYREUIL, April 12th, 2012 - StarChip®, experts in designing and qualifying Smart Card ICs announced today the development of the ARX (Fortress in Latin). The ARX CPU is a High-performance 32-bit RISC Secure Core based on Cortus’ APS3s CPU. This announcement is a step further to confirm StarChip®’s strategic commitment to Smart Card business by extending its product portfolio to payment and ID markets.

To develop their Secure Core, StarChip® selected the APS3s from Cortus. The APS3s is a full 32-bit general purpose CPU specifically designed to meet the requirements of embedded systems.

The APS family are modern RISC processors with Harvard architecture. They feature leading code density and high power efficiency yet also very high performance.

In addition to these state-of-the-art technical features StarChip® and Cortus have signed an agreement allowing StarChip to augment the design of the APS3s to implement embedded security mechanisms. This is the starting point for StarChip® to implement its innovative strategy GAIA: A new vision of self healing security architecture on silicon. As a result the StarChip® Secure Core will embed all the necessary technology to counter both Side-Channel attacks and Fault Injection attacks making it ideal for applications requiring the highest levels of security.

The ARX CPU development is the key to having unsecured software algorithms running in a fully secure way on a CPU without adding costly software counter-measures.

”We have verified the quality and the efficiency of the Cortus APS3s core from our experience in the SIM controller market”, said Yves Fusella, CTO of StarChip®.” Having an agreement between StarChip® & Cortus to modify the APS3s was also a key element in our decision of choosing the APS3 as a starting point for the ARX core. It allows the StarChip® team to use the best design practices and to implement state-of-the-art and innovative security mechanisms while optimizing the overall gate count of the CPU”.

“We are very enthusiastic about this development. StarChip® are showing what can be done with our processor IP and tool chain. Not only does the APS3s offer excellent performance, very low power and a tiny footprint; it is also highly configurable and perfectly corresponds to the needs of chip card security systems. This demonstrates the wide range of applications of our processor cores, from these security systems through wireless metering and to powerful multi-core controllers.” said Michael Chapman, President and CEO of Cortus.

About StarChip®: (www.starchip-ic.com)

StarChip® is a dynamic semiconductor company that enables customers to directly benefit from our unique, optimized value chain system. We design and qualify products for mass production, then license our solutions for purchase directly by our customers through qualified foundries and test houses.

StarChip® products are based on state-of-the art, Flash-based 32-bit architectures. They are designed to offer maximum integration, providing support for embedded, innovative security technologies, analog functionality and connectivity and control interfaces. The result is a flexible set of solutions that can easily meet the requirements of a wide variety of markets, including smart cards and security, consumer, automotive and industrial applications.

About Cortus®:(www.cortus.com)

Cortus is committed to providing high-performance 32-bit processor IP and the surrounding IP and tools. Cortus is a private French company founded in Montpellier in the south of France.

Cortus family of processor IP has been used in a wide variety of products ranging from Pay TV access cards to Cameras and Mobile Phones.

Cortus’ aim is to "Provide a better CPU for low cost embedded systems".

The team has many years experience in multinational companies (Intel, Bosch, Infineon, Siemens, Synopsys), and is composed experts in processor design.

CAMBRIDGE, Mass. -- Computer chips have stopped getting faster. In order to keep increasing chips’ computational power at the rate to which we’ve grown accustomed, chipmakers are instead giving them additional “cores,” or processing units.

Today, a typical chip might have six or eight cores, all communicating with each other over a single bundle of wires, called a bus. With a bus, however, only one pair of cores can talk at a time, which would be a serious limitation in chips with hundreds or even thousands of cores, which many electrical engineers envision as the future of computing.

Li-Shiuan Peh, an associate professor of electrical engineering and computer science at MIT, wants cores to communicate the same way computers hooked to the Internet do: by bundling the information they transmit into “packets.” Each core would have its own router, which could send a packet down any of several paths, depending on the condition of the network as a whole.

At the Design Automation Conference in June, Peh and her colleagues will present a paper she describes as “summarizing 10 years of research” on such “networks on chip.” Not only do the researchers establish theoretical limits on the efficiency of packet-switched on-chip communication networks, but they also present measurements performed on a test chip in which they came very close to reaching several of those limits.

Last stop for buses

In principle, multicore chips are faster than single-core chips because they can split up computational tasks and run them on several cores at once. Cores working on the same task will occasionally need to share data, but until recently, the core count on commercial chips has been low enough that a single bus has been able to handle the extra communication load. That’s already changing, however: “Buses have hit a limit,” Peh says. “They typically scale to about eight cores.” The 10-core chips found in high-end servers frequently add a second bus, but that approach won’t work for chips with hundreds of cores.

For one thing, Peh says, “buses take up a lot of power, because they are trying to drive long wires to eight or 10 cores at the same time.” In the type of network Peh is proposing, on the other hand, each core communicates only with the four cores nearest it. “Here, you’re driving short segments of wires, so that allows you to go lower in voltage,” she explains.

In an on-chip network, however, a packet of data traveling from one core to another has to stop at every router in between. Moreover, if two packets arrive at a router at the same time, one of them has to be stored in memory while the router handles the other. Many engineers, Peh says, worry that these added requirements will introduce enough delays and computational complexity to offset the advantages of packet switching. “The biggest problem, I think, is that in industry right now, people don’t know how to build these networks, because it has been buses for decades,” Peh says.

Forward thinking

Peh and her colleagues have developed two techniques to address these concerns. One is something they call “virtual bypassing.” In the Internet, when a packet arrives at a router, the router inspects its addressing information before deciding which path to send it down. With virtual bypassing, however, each router sends an advance signal to the next, so that it can preset its switch, speeding the packet on with no additional computation. In her group’s test chips, Peh says, virtual bypassing allowed a very close approach to the maximum data-transmission rates predicted by theoretical analysis.

The other technique is something called low-swing signaling. Digital data consists of ones and zeroes, which are transmitted over communications channels as high and low voltages. Sunghyun Park, a PhD student advised by both Peh and Anantha Chandrakasan, the Joseph F. and Nancy P. Keithley Professor of Electrical Engineering, developed a circuit that reduces the swing between the high and low voltages from one volt to 300 millivolts. With its combination of virtual bypassing and low-swing signaling, the researchers’ test chip consumed 38 percent less energy than previous packet-switched test chips. The researchers have more work to do, Peh says, before their test chip’s power consumption gets as close to the theoretical limit as its data transmission rate does. But, she adds, “if we compare it against a bus, we get orders-of-magnitude savings.”

Embedded systems, including mobile devices, now face great demand for data distribution capabilities to interoperate with other systems. In its latest move, ITTIA has announced a new release that provides data distribution features for applications developed with ITTIA DB SQL on WindRiver’s VxWorks -- the industry’s leading embedded real-time operating system (RTOS) -- and enterprise databases such as Oracle, SQL Server, and MySQL.

ITTIA DB SQL is a complete embedded database solution that provides data management, synchronization and data distribution features, enabling VxWorks developers to rapidly develop and deploy data-intensive applications for embedded systems.

Unparalleled Benefits

- Share data stored in ITTIA DB SQL with a back-end RDBMS. Such capability allows developers not only to distribute mobile and embedded data between VxWorks devices and any back-end RDBMS, but also to benefit from the replication environment necessary to improve data availability, reliability, modularity, mobility and interoperability.

- Reduce data management costs, benefit from interoperability, simplify maintenance, and bridge the gap between development of a great VxWorks application and the reality of integrating with a back-end enterprise database.

- Support for the ARM Cortex processor, which provides multi-core processing performance in both symmetric multiprocessing (SMP) and asymmetrical multiprocessing (AMP) configurations.

- Enhanced capabilities, including new security protocols, date and time functions, and scrollable cursors.

- Database file protection from unexpected power loss and other interruptions.

- Support for atomic writes even if the underlying file system does not provide this feature.

- Cross platform flexibility, in addition to compliance with ANSI standards and SQL offered by ITTIA DB SQL for building mission-critical applications.

- Two-phase commit support, which allows applications to perform distributed transactions over two or more ITTIA DB SQL database sites.

- Network traffic optimization enabled by ITTIA DB's table snapshot protocol. This feature enables embedded and device developers to identify and send only modified rows. With this approach, even large tables can be updated without sending the full contents of the table over the network.

- Automatic conflict detection, either by comparing the row contents before and after each change, or by generating a unique stamp each time a row is modified. ITTIA DB supports policy-based conflict resolution and provides the replication environment needed to improve system availability with distributed commits or synchronous replication across multiple sites.

About ITTIA

ITTIA offers database solutions for platforms where limited memory, storage, and processing power makes software development challenging. ITTIA develops fast, high performance database products and tools with the goal of providing excellent data management software for embedded systems and devices. ITTIA products are designed to be suitable for application development and deployment at a significantly reduced cost. ITTIA customers include GlaxoSmithKline, VNU, Boeing, Moodys, Sandia National Laboratory, Puget Sound Energy and others. You can obtain more information about ITTIA at: www.ittia.com.

April 10, 2012, Toronto, Canada. ALT Software has added support for Green Hills Software’s latest version of the INTEGRITY-178B RTOS for multicore processors in its market leading DO-178B certifiable OpenGL driver architecture.

Multicore processors are becoming increasingly popular in aerospace and defense computing architectures as they enable embedded systems to scale performance and functionality without sacrificing the reliability required by safety critical avionics applications. Embedded real-time use case scenarios include improving safety by running an application redundantly on separate cores, improving performance by running multi-threaded applications across multiple cores, and improving the reliability of safety critical applications by running safety critical and non-safety critical applications on separate cores.

Supported system configurations include Freescale’s QorIQ family of multicore processors found in innovative single board computers such as the X-ES XPedite5470, in combination with graphics cards designed specifically for harsh environments, such as the GXPMC-5 product line from Lockheed Martin. ALT’s DO-178B certifiable drivers can be customized to support a variety of leading embedded graphics processors from manufacturers such as AMD, Fujitsu, Intel and Imagination Technologies.

“ALT has been a long time trusted and proven provider of graphics solutions to Green Hills INTEGRITY-178B customers,” said Pat Rodenbeck, Vice-President of Safety and Security Critical Products at Green Hills Software. “We are very pleased that they have chosen to support the newest and most advanced release of our INTEGRITY-178B RTOS, which now incorporates advanced partition scheduler technology for multicore processors referred to as Time-variant Unified Multiprocessing (tuMP). Green Hills looks forward to continuing our proven partnership with ALT Software and recommending ALT’s high reliability embedded graphics drivers to our safety and security critical multicore customers.”

“Multicore processing is offering many new possibilities in the field of embedded computing, and ALT Software is working diligently with RTOS partners like Green Hills to unlock that potential,” said Robert Atkinson, Vice-President of Sales and Marketing at ALT Software. “Embedded graphics drivers that have not been specifically architected to manage multicore processing can impact system stability when multiple commands are sent simultaneously to the GPU or when multiple iterations of the driver are running on separate cores and simultaneously delivering commands to the GPU. ALT Software’s latest graphics driver updates will ensure system stability and optimal performance at all times by supporting all popular methods of time and space partitioning.”

The Green Hills INTEGRITY-178B RTOS and ALT Software’s OpenGL graphics drivers are currently deployed worldwide in the avionics display systems of a variety of modern military and commercial aircraft. They are DO-178B certifiable up to Design Assurance Level A for safety critical systems.

About ALT Software

ALT Software is the world’s leading supplier of advanced graphics solutions for high reliability embedded computing platforms. They provide OpenGL, OpenGL ES, and OpenGL SC (DO-178B certifiable) graphics drivers for a number of popular SoCs and discrete GPUs. ALT’s customizable high-performance embedded graphics drivers support a wide variety of system configurations. Their products support the full spectrum of low to high performance graphics requirements of various embedded systems and are designed for deployment in aerospace and defense systems as well as automotive, medical, industrial, and consumer devices.

www.altsoftware.com

About Green Hills Software

Founded in 1982, Green Hills Software is the largest independent vendor of embedded development solutions. In 2008, the Green Hills INTEGRITY-178B RTOS was the first and only operating system to be certified by NIAP (National Information Assurance Partnership comprised of NSA & NIST) to EAL6+, High Robustness, the highest level of security ever achieved for any software product. Their open architecture integrated development solutions address deeply embedded, absolute security and high-reliability applications for the military/avionics, medical, industrial, automotive, networking, consumer and other markets that demand industry-certified solutions. Green Hills Software is headquartered in Santa Barbara, CA, with European headquarters in the United Kingdom. Visit Green Hills Software at www.ghs.com.

eInfochips Announces Smallest Form-Factor System-on-Module around Texas Instruments' DaVinci™ DM816x and DM814x

SUNNYVALE, Calif. and AHMEDABAD, India. eInfochips, a leading product engineering services company, today announced the launch of the smallest form-factor system-on-module (SOM) developed based on DaVinci™ DM816x and DM814x video processors from Texas Instruments Incorporated (TI). eInfochips, which has over 15 years of end-to-end electronic product design and development experience, has developed a pin-compatible SOM for DaVinci DM816x and DM814x video processors with different pin maps.

The compact form-factor SOM (75 mm x 37 mm) is an ideal off-the-shelf solution for product developers designing high-end video processing systems. The SOM addresses the key challenge of designing and developing customized hardware solutions for different industry verticals and product segments. With maximum hardware complexity handled by a re-usable SOM, customers can derive multiple advantages including reduced development time and cost.

The solution empowers product companies to enrich their product mix by integrating a SOM into different carrier cards for launching multiple product variant. The SOM can also be easily integrated into existing hardware systems, to maximize computing power for performance improvement.

"We wanted to assist product designers in developing products with reduced time, effort and cost, to foster innovation. This was “the aim” when we conceptualized the SOM based on TI's DaVinci DM816x and DM814x video processors," said Dhaval Parikh, hardware division head, eInfochips. "The pin-compatible, smallest form-factor SOM combines the benefits of TI's high-end video processing SOCs for developing high-end video-specific applications. Throughout development, we put special emphasis on thermal and power stability without compromising on providing superior performance with the smaller form-factor."

Application Areas

• Video controllers (machine vision, medical imagining)

• High-end video processing IP cameras

• Video surveillance recorders

• Medical video recorders

• Digital signage

• Multichannel video server

• Video conferencing

• A range of multimedia applications that require high-end video processing

eInfochips, member of the TI Developer Network, has a proven track record of system and product development on TI's various processor platforms. The new design of this pin-compatible SOM based on TI's DaVinci DM816x and DM814x video processors is a great example of eInfochips' design capabilities around TI's SOCs, " said Cyril Clocher, business unit manager, video security, TI. "Based on our decade-old relationship with eInfochips, we are excited about the enhanced system performance this SOM will give our video customers."

eInfochips offers SOM-based product development as well as application-specific SOM development services to end application customers.

For more information on the eInfochips SOM, please visit:

www.einfochips.com/ips-frameworks/netra-and-cen[...]

Availability: The SOM based on TI's DaVinci DM816x and DM814x video processors are available for purchase. Please e-mail sales@einfochips.com for more information.

Hardware Design Expertise of eInfochips

• Developed over 500 complex hardware designs on various SoCs

• PCB design up to 16 layers

• Over 4200 components on single board

• Hardware design with frequency > 1GHz

• Multi-core SoC design, Multi-processor (8 dual-core processor on a single board) designs, Multi-FPGA based designs

• Board size ranging from 1.4 square inches to 140+ square inches

• Partnership with Labs for hardware certification – CE, FCC, UL, FAA, Ingress Protection (IP) ratings and DO-254A & DO-178B guidelines

About eInfochips: eInfochips is a CMMi Level 3 & ISO 9001:2008 certified Product Engineering Services company offering a broad portfolio of services comprising New Product Development, QA & Independent Testing, and Product Sustenance to key industry verticals including Consumer Electronics, Video Streaming, Security & Surveillance, Medical & Healthcare, Aerospace & Defense, MachineVision & Imaging, and Systems.

About the Texas Instruments DSP Third Party Network

eInfochips is a member of the TI DSP Third Party Network, a worldwide organization of independent companies that offer products and services supporting TI DSPs. TI third parties provide expertise across a variety of applications, including audio, control, telecom, video and imaging, and wireless communications. Third party products and services include a broad range of application software, development hardware and software, and consulting services that support original equipment manufacturers' efforts to bring differentiated products to the market quickly.

Chatsworth, Calif. April 2012 – Aitech Defense Systems Inc., a pioneer in true embedded and mission critical computing technologies for environmentally-demanding military, defense and aerospace applications, now offers the highly-integrated, compact RediBuilt rugged COTS computer that boots and executes your real-time operating system right out of the box. This flexible computer can accommodate either Intel or Freescale processors as well as a CompactPCI or OpenVPX backplane in a condensed package measuring less than 0.22 ft3, comparable in volume to a 1/4 ATR Short enclosure.

Designed to TRL 9 (Technical Readiness Level) as defined by the DoD, NASA and other government agencies, RediBuilt eliminates all NRE (non-recurring engineering) and customization costs. It is a highly capable, fully functioning embedded computing subsystem proven through successful operation, complete with built-in, real-world I/O and HD (high definition) graphics and video capabilities.

Equipped with standard, circular MIL-DTL-38999 I/O connectors on the front panel and a two-slot 3U CompactPCI or OpenVPX backplane, RediBuilt provides all system interconnections, internal power distribution and filtering circuitry pre-assembled in the unit.

The computer’s integrated functionality, combined with its lightweight, rugged aluminum enclosure, makes the RediBuilt ideal for demanding applications where SWaP (size, weight and power) is important, as found extensively in military and airborne computing environments.

Both unmanned airborne systems (UAS) and unmanned ground vehicles (UGV) benefit from the RediBuilt’s compact size as well as the full environmental sealing that protects the unit from water, sand, dust, humidity, immersion and condensation. The unit measures 202 mm (W) x 260 mm (D) x 126 mm (H) and weighs less than 13 lbs complete.

Systems can be built to different power levels depending on the application and reliability needed. The various high-performance Freescale and Intel processor options in single, dual or multi-core configurations are available with a host of standard I/O, including Gigabit Ethernet, serial ports, discrete I/O, USB, SATA and CANbus and more.

Additional real-world sensor and effector I/O, including A/D, D/A, Servo, Resolver and RTDs can be added via industry standard PMC/XMC mezzanine sites.

The modular, MIL-STD-704, high-efficiency 28 VDC power supply unit and power input filter ensures reliable operation over a wide 18 VDC to 36 DC input voltage range and provides EMI/EMC compliance.

This new, sealed, rugged COTS computer utilizes internal conduction cooling. External cooling is achieved through convection cooling using fins to dissipate heat or by conduction cooling via a coldplate interface. RediBuilt supports industry standard PMC and XMC mezzanines for easy expansion of function and I/O. Supported operating systems include VxWorks, INTEGRITY, Windows and Linux.

Relying on more than 30 years of military computing expertise, Aitech designs, builds and tests all aspects of each integrated RediBuilt subsystem to ensure full operation and reduce program risks.

For more information please call 888-Aitech-8 (888-248-3248), visit www.rugged.com/a190-redibuilt-integrated-rugged[...] or e-mail sales@rugged.com.

For high res download and full text:

www.simongroup.com/PressRoom/press-release.php?[...]

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About Aitech:

Established in 1983, Aitech offers military and space-qualified, commercial off-the-shelf (COTS) embedded computing products for rugged defense, aerospace and astronautics (space) applications as well as provides radiation tolerant and full MIL-SPEC solutions. The company provides industry-standard, open architecture VMEbus, CompactPCI and high speed serial fabric-based boards, power subsystems, mass memory, enclosures and hardware subsystem integration along with logistics, configuration control, component obsolescence and earned-value management services.

Having pioneered the development of true military VMEbus products for use in mainstream defense and aerospace applications, Aitech utilizes its broad base of off-the-shelf products and technologies to also develop customer-specific solutions, deliver superior cost-performance and reliability, and expedite time to market.

Applications for its products range from mission processors, fire control, mission control and autonomous robotic subsystems for ground vehicles as well as surface and subsurface naval platforms to tactical and strategic fixed- and rotary-wing aircraft, and low- to high-earth orbit and deep space vehicles.

Vienna, Austria – April 03, 2012 – Ronetix, the austrian supplier of high-performance JTAG/BDM/SWD devlopment tools, has launched today a new PEEDI support for debugging and FLASH programming of the Freescale QorIQ family (P1010, P1020, P2040, P4080, etc.).

Currently the company's power embedded debug interface (PEEDI) supports a wide range of processor architectures including ARM, Cortex, XScale, Freescale Nexus enabled Qoriwa, ColdFire, Blackfin, MIPS32 and AVR32. With the introduction of support for Freescale's QorlQ processors RONETIX provides customers with increased effectiveness in Flash programming and high speed GNU gdb debugging, expanded multicore support for up to 4 cores, and additional choice for evaluating leading processor architectures.

More specifically the PEEDI can be used with any GNU gdb based debugger Eclipse, without any additional software, which makes PEEDI host operating system independent. Additionally PEEDI supports programming of over 1000 NOR Flash chips, NAND Flash, SPI and I2C FLASH/EEPROM and can work in standalone mode.

Furthermore the PEEDI supports several flash profiles, which enables the programming of a complete Linux system at once: U-BOOT, Linux Kernel and JFFS2/YAFFS/UBIFS root file system.

RONETIX's EmbeddedICE solution is targeted for all phases of the development and is extensible for customers to easily firmware update for additional device architectures and processors.

RONETI's PEEDI with support for the Freescale QorIQ family is available now.

For additional information, please visit : www.ronetix.at/peedi.html

RONETIX is an Austrian embedded company for producing and developing high-quality development tools that fit customer’s unique needs and provide service and support before, during and after the sale.

As a result of the close cooperation with Freescale and STMicroelectronics in the Joint Development Program (JPD), customers will have in time access to TRACE32®, the industry′s leading development tool, and can take advantage of the premium technical support available worldwide from Lauterbach.

German based Lauterbach had a turnover in excess of $90 million worldwide during 2011 and has seen its customer base grow year on year. Recognised for both engineering excellence and exceptional technical support, Lauterbach tools have become a favourite with many hi-tech engineers. Lauterbach tools support more than 3500 microprocessors and all known ARM Cores, covering products from over 75 silicon companies. The quality and capability of these tools enables engineering teams to develop robust code whilst minimising development time lost to debugging.

TRACE32® provides two alternative options for debugging the MPC57xx/SPC57x family. The PowerDebug probe provides debugging through the JTAG interface (OnCE) for the entire debug process including code download, flash programming and source code debugging. The TRACE32® PowerView software includes a comprehensive and user friendly HLL debugger for C and C++ as well as awareness for most of the commonly available real-time operating systems. Multicore debugging can be undertaken in AMP, SMP or Lockstep mode.

The PowerTrace system adds off-chip trace features to the basic debug functionality by utilizing the Nexus class 3+ interface on the chip. Up to 4GByte of instruction and data trace can be non-intrusively captured, providing developers with a back trace for debug and also extensive run-time statistics and performance analysis. The Context Tracking System (CTS) allows the user to track the contents of registers and memory from a sampled real-time trace. This makes it possible to undertake a detailed analysis of the program execution on HLL level. Stepping "back into time" and examining variables as they where at any specific point in the program run is just one of the powerful capabilities of CTS.

The tools can be connected to either Windows or Linux hosts via USB 2.0 or Ethernet 10/100/1000. All TRACE32® PowerTools comply with the RoHS (Restriction of Hazardous Substances) directive

About Lauterbach

Lauterbach is the world’s largest producer of hardware-assisted debug tools. Its engineering team has more than 30 years of experience in making world-class debuggers and emulators. The company attaches great importance to very high technical standards and only the latest development methods are used. This sound technical know-how has a high priority in the sales, support and training departments contributing to the technical expertise that is highly regarded by their customers across the world. www.lauterbach.com www.lauterbach.com

Vienna, Austria – March 28, 2012 – Ronetix announced today the availability of the new firmware of its high speed JTAG/BDM/SWD Emulator and Flash Programmer. The new firmware adds support debugging and FLASH programming of the Freescale QorIQ family (P1010, P1020, P2040, P4080, etc.).

Now PEEDI can be used for high speed GNU gdb debugging and Flash Programming of all ARM7, ARM9, ARM11, Cortex-M0/M3, Cortex-A5/A8/A9, XScale, Freescale Nexus enabled Qoriwa MPC55XX, MPC56XX, MPC51XX, MPC52XX, MPC83XX, MPC85XX, ColdFire, Blackfin, MIPS32 and AVR32 based CPUs.

Because of its built-in GNU gdb support, PEEDI can be used with any GNU gdb based debugger Eclipse, without any additional software, which makes PEEDI host operating system independent.

The built-in Flash Programmer of PEEDI supports programming of over 1000 NOR Flash chips, 8-bit and 16-bit NAND Flash, SPI and I2C FLASH/EEPROM, SD/MMC/eMMC devices connected to the CPU.

PEEDI supports also programming of the internal Flash memory of Actel A2F, Analog Aduc7, Atmel AVR32UC3, AT91SAM3, AT91SAM7, AT91SAM9, EnergyMicro EFM32, Freescale Kinetis, MAC7000, ColdFire MCF, Qoriwa MPC, Microchip PIC32, ST STM32, STR7, STR9, TI TMS470, Luminary/TI LM3S, NXP LPC, family.

PEEDI supports several flash profiles, which enables the programming of a complete Linux system at once: U-BOOT, Linux Kernel and JFFS2/YAFFS/UBIFS root file system.

Among the advantages of PEEDI are:

Multi core support - up to 4 cores

Built-in support for gdb (remote target via Ethernet).

Very high real download speed – up to 1.25 Mbytes/s.

5 kHz – 33MHz JTAG/BDM clock using 35cm standard cable.

Automatic measuring and compensating of delays in the JTAG signals

Target Voltage 1.2V – 5V.

Built-in telnet command line interface.

Built-in very fast Flash programmer that supports over 900 Flash devices.

Can be used as a standalone Flash Programmer, up to 15 images can be stored on MMC/SD card, controlled by front panel interface.

Small robust aluminum case.

DCC over TCP support.

OS awareness.

GDB FLASH programming.

For sales information on RONETIX’s products contact:

sales@ronetix.com

Tel: +43-1-2361101

Fax:+43-1 8174 955 3464

www.ronetix.com

March 27, 2012 - ADL Embedded Solutions Inc., a solutions provider of embedded products including full turn-key embedded systems, industrial single board computers (SBCs), peripherals, and accessories, today has announced it’s first Quad core processor available in a PC/104 form factor, ADLQM67PC-2715QE. The 2nd generation Intel® Core™ i7-2715QE processor incorporates Intel's latest embedded two-chip platform. This 2nd generation i7 Quad processor integrates Intel’s HD Graphics 3000 engine with AVX (Advanced Vector Extensions) as well as the memory controller functions of a traditional GMCH. The QM67 Platform Controller Hub (PCH) provides PCI-Express I/O bandwidth at twice the speed (5 GT/s) of previous i7 or Core 2 Duo platforms.

In addition to the wide range of rugged and harsh environment applications in which the ADLQM67PC can excel, it also supports a healthy set of features. The ADLQM67PC has a discrete 16-bit digital I/O port as well as separate VGA, LVDS, HDMI and Display Port interfaces. The ADLQM67PC also has 2x RS232 COM ports, 2x SATA 6Gb/s with RAID support, 8x USB2.0, two bootable Gigabit Ethernet LAN, HDA 7.1, and type 1 bottom-stacking PCIe/104 V2.01 supporting Gen2 throughput of 5 GT/s are just a few of the available features. The ADLQM67PC-2715QE will be first pre-viewed at the ESC 2012 show in Silicon Valley, March 27 – 29th.

The ADLQM67PC is ideal for rugged applications where high multi-core processing performance is critical. It brings unparalleled performance to applications such as radar and sonar processing, image signal processing, tactical command and control, surveillance and reconnaissance, transportation and railway.

“According to JC Ramirez, ADL Embedded Solutions Product Manager, “Intel® Core™ Quad processing performance in a form factor this small (PCIe/104) is unprecedented. At 96mm x 115mm, the ADLQM67PC-2715QE provides a complete Intel® Core™ Quad single board computer in less space than any other form factor. This gives the ADLQM67PC a unique advantage for applications requiring Intel® Core™ Quad performance in a small footprint with temperatures from commercial to industrial range and simple to highly rugged environments.”

For additional information about the ADLQM67PC-2715QE, stop by booth #1442 at the ESC show in San Jose, March 27-29, or please visit www.adl-usa.com/products/cpu/datapage.php?pid=A[...]. For system pricing, contact ADL Embedded Solutions at 858.490.0597 or email sales@adl-usa.com.

About ADL Embedded Solutions Inc.

ADL Embedded Solutions Inc. is a solutions provider of embedded products including full turn-key embedded systems, industrial single board computers (SBCs), peripherals, and accessories. ADL Embedded Solutions diverse portfolio of products range from SBCs based on the AMD Geode™ and Intel® Atom® processors through high-performance Intel® Core™ i7 Sandy Bridge built in PC/104 and 3.5” form factors, all of which can be delivered as part of a full system, or individual boards. Value-added services include ruggedization for high shock and vibration, extended temperature, and harsh environments, as well as CAD services including board modeling support and full enclosure design, build, and integration.

ADL Embedded Solutions serves customers in a variety of markets, including Medical, Transportation, Defense, Aerospace, Communication, Security, Process Control, and Science. For more information about ADL Embedded Solutions, visit its website at www.adl-usa.com or www.adl-europe.com.

MILPITAS, Calif., March 27, 2012 – LSI Corporation (NYSE: LSI) presenters will discuss ways to add intelligence and acceleration to mobile and enterprise networks so operators and datacenter managers can manage the ever-increasing user demand at the 7th Annual Multicore Developers Conference March 27-29 in San Jose, Calif. The company will also have experts on hand to demonstrate and discuss its latest products.

“With growing industry concerns about a looming spectrum crunch, intelligent acceleration is playing a more critical role in enhancing network and application performance and helping operators improve productivity in their networks,” said Noy Kucuk, vice president of marketing, Networking Components Division, LSI. “A backbone of intelligent systems is needed to ensure the highest quality end-user experience as people connect with each other, share and view their data for both business and entertainment on tablets, TVs and smartphones.”

LSI delivers intelligent systems that:

• Accelerate mobile and enterprise networks by adding the ability to identify different types of network traffic and prioritize critical data

• Replace power-hungry components, allowing storage and networking systems to run faster, take less space, consume less power and require less cooling

• Enable service providers to improve customer loyalty and drive revenue growth by offering mobile applications with faster, more predictable performance, better security and more intelligence

At the show, LSI will demonstrate:

• Solutions for managing quality of service in virtualized environments

• Content caching for content-delivery networks using LSI networking and storage solutions

LSI’s speakers at Multicore DevCon include:

• Paulus Pouw, System Application Engineer

Maximizing Multicore Processor Efficiency with Parallel Programming Paradigms

Tues., Mar. 27; 1:10 – 1:55 p.m.

• Sundar Vedantham, Technical Manager

Network Traffic Monitoring With Multicore Processors

Tues., Mar. 27; 2:00 – 2:45 p.m.

• Noy Kucuk, Vice President, Marketing, Networking Components Division

Combatting the Wireless Spectrum Apocalypse of 2013

Wed., Mar. 28; 2:00 – 2:35 p.m.

LSI will be located at booth #1938. For more information on LSI and the company’s products, visit www.lsi.com.

About LSI

LSI Corporation (NYSE: LSI) designs semiconductors and software that accelerate storage and networking in datacenters and mobile networks. Our technology is the intelligence critical to enhanced application performance, and is applied in solutions created in collaboration with our partners. More information is available at www.lsi.com.

The Drive for Innovation – a year-long, cross-country road trip created to celebrate electronics innovation, is making a stop at DESIGN West and bringing 20 students along for the ride. The University Grant Program, sponsored by Avnet Express, the e-Commerce engine of Avnet, Inc. (NYSE: AVT) and UBM Electronics, the daily source of essential business and technical information for the electronics industry's decision makers, will cover the attendance cost for students from San Jose State University's College of Engineering Mechatronics to attend DESIGN West, March 26-29, 2012 at the McEnery Convention Center in San Jose, CA.

DESIGN West builds on the rich engineering education foundation of the well-established Embedded Systems Conference (ESC), which is now combined with popular electronic design summits (Android Summit, Black Hat Summit, DesignMED, Multicore DevCon, EDN's Designing with LEDs, Sensors in Design) in one venue for the first time. The DESIGN West University Grant Program has been developed to provide college and graduate school professors with a mentorship opportunity for their engineering students to attend the conference program at UBM Electronics events. The grant will cover conference registration fees; plenary sessions; breaks; lunch; full access to the exhibition floor; technology demonstrations; and show floor receptions.

"The University Grant program is an important initiative – it provides an opportunity for the next-generation of design engineers to attend DESIGN West, which ensures continued growth and vitality of our industry," said Brian Fuller, editorial lead, Drive for Innovation. "The Drive for Innovation is focused on uncovering innovation in the electronics industry. By sponsoring this program Avnet Express continues to inspire future technologists and engineering rising stars."

"Throughout the past year, the Avnet Express Drive for Innovation has crossed the U.S. exposing the very best of American ingenuity," said Ian Basey, vice president, Avnet Electronics Marketing Americas. "As we continue this program, the University Grant will expose young engineers to technology experts, mentors and leaders in our industry, to hopefully keep fueling the future of innovation."

The Electrical Engineering Department at San Jose State University is a leading provider of engineering talent to Silicon Valley's high-tech industry. Ranked by US News and World Report among the best BS/MS universities in the country, the Electrical Engineering Department provides more EE graduates to this region than any other college or university in the nation. Most of its EE graduates are employed in diverse areas of hi-tech engineering, including internet technologies, semiconductor electronics, analog and digital systems and wireless communication technologies.

"We are honored that UBM Electronics and Avnet Express are supporting our students to attend DESIGN West," said Burford J. Furman, professor, Department of Mechanical and Aerospace Engineering, San Jose State University. "The conference is an outstanding forum for our students -- who are working toward engineering degrees -- to learn and network with industry leaders. I am confident that this opportunity will help inspire innovation in our students as they progress through their course of study and begin to work in the electronics and related industries."

PARIS, March 26, 2012 — 6WIND, the gold standard for software-defined networks, today announced the availability of 6WINDGate™ Cloud Edition, an extension to its software product line that provides industry-leading cost/performance for data center network appliances. Building on the success of its Mobile Edition software, already deployed in two-thirds of LTE networks worldwide, 6WIND has developed the Cloud Edition version to apply its proven, unique technology to address critical performance and scalability challenges faced by cloud infrastructure providers.

The 6WINDGate Cloud Edition product includes an integrated suite of optimized networking protocols matched to the specific requirements of network appliances. These include protocol termination, QoS, routing, switching, security, tunneling and VPN functions. Cloud-focused services provided within 6WINDGate Cloud Edition include virtualization with support for industry-standard hypervisors.

“Because it addresses critical issues in network bandwidth, scalability and Quality-of-Service, our 6WIND Mobile Edition software has been adopted by multiple tier-1 telecom equipment manufacturers worldwide,” said Eric Carmès, CEO of 6WIND. “The new 6WINDGate Cloud Edition product leverages the same technology strengths to accelerate the deployment of high-performance, cost-effective and flexible network appliance solutions. These include Application Delivery Controllers (ADCs), firewalls, security gateways and Intrusion Prevention systems.”

Facing on-going CAPEX pressures, data center operators are challenged to migrate to commodity hardware platforms as quickly as possible, while continuing to deliver increased performance to end-users. At the same time, OPEX constraints require improvements in resource utilization, achieved through the efficient management of Virtual Machines (VMs) and virtual appliances. With no way to predict the future mix of applications or the growth in workloads, data center networks must be architected for maximum flexibility and scalability, leading to the adoption of Software-Defined Networks based on open standards.

Suppliers of both physical and virtual network appliances for data centers must deliver new cloud-optimized solutions that provide best-in-class cost/performance, while also accelerating their development schedules so as to be early to market in new product categories.

To optimize cost/performance for network appliances, 6WINDGate Cloud Edition leverages a unique software architecture to deliver a 10x in networking performance for existing applications, while implementing comprehensive support for commodity processor platforms.

Full support for industry-standard hypervisors enables 6WINDGate to be deployed in virtual network appliances, with no performance impact. Maximizing appliance throughput enables a large number of VMs to be deployed on a single platform, together with their respective applications.

Providing full scalability across processors, blades and racks, 6WINDGate also avoids the complexity of instantiating multiple VMs as bandwidth requirements increase, enabling data center operators to configure a single VM on several physical blades.

“The rapid growth of mobile devices and the emerging class of machine-to-machine applications will accelerate the adoption of software-defined networking solutions and virtual appliances,” continued Carmès. “To support this exciting future, we will continue to enhance 6WINDGate Cloud Edition through improvements in resource utilization that can be achieved through more efficient management of Virtual Machines and Virtual Networking Appliances.”

“Data center operators must meet aggressive OPEX and CAPEX objectives while also architecting their networks for maximum scalability and optimum network monetization,” said Simon Stanley, Analyst at Large for Heavy Reading. “At the same time, they must deploy optimized solutions comprising both physical and virtual network appliances, since both appliance types will co-exist for the foreseeable future. The 6WINDGate Cloud Edition software, based on technology proven in the mobile infrastructure market, provides an ideal balance of features for addressing these critical cloud networking challenges.”

The 6WINDGate Cloud Edition software will be available in Q2 2012. For more information please visit http://www.6wind.com.

About 6WIND

6WIND, the gold standard for software-defined networks, transforms mobile and cloud infrastructure by providing scalable, high-performance, low-latency networking software optimized for cost-effective hardware based on multicore processors, while enabling Network-as-a-Service capabilities that monetize network services such as bandwidth, QoS and security. The company’s 6WINDGate™ software delivers sustainable competitive advantages to network operators, service providers, system integrators and network equipment providers. 6WIND is a privately owned company based near Paris, France with offices in Mountain View, California, Seoul, South Korea and Beijing, China. For more information, visit http://www.6wind.com.

FREMONT, CALIF. -March 20, 2012 -Users of the latest Microsoft(r) Windows(r) 7 operating system will be pleased to hear that American Portwell Technology, Inc., (www.portwell.com) has released WEBS-3560B, a new embedded fan-less system with Mobile Intel(r) QM57 Express chipset, DDR3, AMT 6.0 and an Intel(r) Core(tm) i7/i5/i3-based Mini-ITX board. According to American Portwell, WEBS-3560B provides higher mobile computing performance and full HD 1080P graphics capabilities to help users who are not satisfied with the solutions that the previous Core 2 Duo and Core 2 Quad can provide.

In addition to its core Intel components, WEBS-3560B includes: dual-channel DDR3 SO-DIMM support up to 8GB; dual-display by VGA/DVI/HDMI; 1 x Mini PCI-E; 6 x USB 2.0; dual GbE based on PCI-E x1 high bandwidth I/O interface; Intel Active Management Technology (AMT) 6.0; Intel Hyper-Threading Technology; and support for a wide input range of 12V to 36V DC.

American Portwell's WEBS-3560B system is available now for applications such as point-of-sale (POS), lottery, medical, gaming, high-resolution digital signage, surveillance security monitoring and kiosk.

American Portwell Technology, Inc., is a wholly owned subsidiary of Portwell, Inc., a world-leading innovator in the embedded computing market and a Premier member of the Intel Embedded Alliance.

Control and secure remote assets

"A key feature of WEBS-3560B is the fan-less solution based on Intel's Core i7/i5/i3 processor," says Robert Feng, American Portwell Technology's product marketing manager. "Fan-less operation not only prevents unnecessary noise, but also avoids catastrophic fan failure

while improving product reliability." Feng points out that customers using the new WEBS-3560B will also benefit from the combination of the Intel Core i7/i5/i3 multi-core processor with Hyper-Threading Technology because it provides high performance computing power, while AMT 6.0

hardware-based security management technology allows their IT department to remotely manage and secure networked computers out-of-band as well control over system assets and an improved ability to discover, diagnose, heal, update and protect these valuable assets. We see the additional features offered by the new WEBS-3560B as providing a lifeline to users who feel they are sinking under the constraints of the previous Core 2 Duo and Core 2 Quad-based solutions," Feng adds.

Remote network security management

According to Frank Shen, American Portwell Technology's vice president of product marketing, the new WEBS-3560B will appeal to systems integrators because the on-board AMT 6.0 provides hardware-based remote network security management, which means SIs can install software and manage the system after it has been deployed. "It also benefits project management," Shen explains, "because it makes maintenance schedules easier to arrange and reduces IT costs. Plus," he adds, "the fan-less design means the WEBS-3560B can be installed in remote areas that are not easy to reach without worrying about replacing the unit due to fan

failure.

"All in all," Shen confirms, "our customers not only benefit from American Portwell's ability to consistently provide the most up-to-date technology and features, but they also gain peace of mind from the long life cycle support inherent with every Portwell product."

About American Portwell Technology

American Portwell Technology, Inc., is a world-leading innovator in the embedded and industrial computing market and a Premier member of the Intel Embedded Alliance. American Portwell Technology designs, manufactures and markets a complete range of PICMG computer boards,

embedded computer boards and systems, rackmount systems, and network/communications appliances for both OEMs and ODMs. American Portwell is both an ISO 9001:2008 and ISO 13485:2003 certified company. The company is located in Fremont, California. For more information about American Portwell's extensive turnkey and private-label branding

solutions, call 1-877-APT-8899, email info@portwell.com or visit us at www.portwell.com.