• 10 Gigabit backplane Ethernet for embedded supercomputers

    Designers of next-generation high-performance embedded computing (HPEC) solutions for demanding intelligence, surveillance, and reconnaissance (ISR) systems applications got a boost from the introduction of Intel’s multicore Xeon D system-on-chip (SoC) processor earlier in 2016. This device provides as many as 16 cores in the same power footprint as earlier four-core devices and features the rugged ball-grid-array (BGA) packages and extended temperature range needed for deployed applications.


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